ispPAC-POWR607-01SN32I Lattice, ispPAC-POWR607-01SN32I Datasheet - Page 4

• Manufacturer Part Number: ispPAC-POWR607-01SN32I
• Description: Supervisory Circuits Prec Prog Pwr Supply Seq Mon IND
• Manufacturer: Lattice
• Type: Power Supply Sequencer and Monitorr
• Series: ispPAC®r

Specifications of ispPAC-POWR607-01SN32I

• Internal Hysteresis: Yes
• Minimum Operating Temperature: - 40 C
• Output Type: Open Collector / Drain
• Power Fail Detection: Yes
• Number Of Voltages Monitored: 6
• Monitored Voltage: Adj V
• Undervoltage Threshold: Adj
• Overvoltage Threshold: Adj
• Manual Reset: Resettable
• Watchdog: Yes
• Power-up Reset Delay (typ): 100 us
• Supply Voltage (max): 3.96 V
• Supply Voltage (min): 2.64 V
• Supply Current (typ): 3.5 mA
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 85 C
• Package / Case: QFN-32
• Applications: General Purpose
• Voltage - Input: -0.3 V ~ 5.9 V
• Voltage - Supply: 2.64 V ~ 3.96 V
• Current - Supply: 3.5mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Lattice Semiconductor
Absolute Maximum Ratings
Absolute maximum ratings are shown in the table below. Stresses beyond those listed may cause permanent dam-
age to the device. Functional operation of the device at these or any other conditions beyond those indicated in the
recommended operating conditions of this specification is not implied.
Recommended Operating Conditions
Analog Specifications
I
I
I
1. Includes currents on both V
2. In power-down mode, VCCJ is internally pulled to GND to turn off the JTAG I/O pins. It is important, therefore, that the VCCJ pin be open
3. Leakage measured in power-down mode with applied pin voltages as follows: VCC = 3.96V; IN1_PWRDN, GND = 0V; IN2, VMONx and
V
V
V
V
V
T
T
I
V
V
V
V
V
T
T
1. The die pad on the bottom of the QFN/QFNS package does not need to be electrically or thermally connected to ground.
CC
CCJ
CC_PWRDN
SINKMAX
A
APROG
A
S
CC
CCJ
IN
MON
TRI
OUT
CC
CCJ
IN
MON
Symbol
whenever power-down mode is initiated. If connected to a power supply during power-down mode, VCCJ will draw approximately 2.2mA.
IN_OUTx = 5.5V; HVOUTx configured as FET drivers (HVOUTx configured as open drain outputs have minor leakage path to ground and
are not counted in total); VCCJ, TDI, TDO, TMS and TCK = open.
1
2
Symbol
Symbol
3
Supply current
Supply current
Power-down mode supply current
Core supply
JTAG logic supply
Digital input voltage (all digital I/O pins)
V
Voltage applied to tri-stated pins
Storage temperature
Ambient temperature
Maximum sink current on any output
Core supply voltage at pin
JTAG logic supply voltage at pin
Input voltage at digital input pins
Input voltage at V
Open-drain output voltage
Ambient temperature during
programming
Ambient temperature
MON
Parameter
CC
input voltage
pins.
Parameter
Parameter
MON
pins
ICC + pin leakage currents
Conditions
4-4
HVOUT[1:2] pins in open-
IN_OUT[3:7] pins
Power applied
Conditions
drain mode
(Note 1)
IN_OUT[3:7]
HVOUT[1:2]
Conditions
2
1
Min.
ispPAC-POWR607 Data Sheet
Min.
2.64
2.25
Min.
-0.3
-0.3
-0.3
-0.3
-0.5
-0.5
-0.5
-0.5
-0.5
-0.5
-40
-40
-65
-65
Typ.
3.5
Max.
Max.
3.96
10.4
150
125
4.5
3.6
5.5
5.9
5.5
Max.
85
85
11
23
6
6
6
6
10
5
1
Units
Units
Units
mA
o
o
o
o
mA
mA
V
V
V
V
V
V
µA
V
V
V
V
V
V
C
C
C
C