TGA2521-SM-T/R TriQuint, TGA2521-SM-T/R Datasheet - Page 18

• Manufacturer Part Number: TGA2521-SM-T/R
• Description: RF Amplifier 17 - 24 GHz Driver
• Manufacturer: TriQuint
• Type: Linear Driver Amplifierr

Specifications of TGA2521-SM-T/R

• Mounting Style: SMD/SMT
• Operating Frequency: 17 GHz to 24 GHz
• P1db: 23.5 dBm
• Noise Figure: 5 dB
• Operating Supply Voltage: 5 V
• Supply Current: 320 mA
• Maximum Power Dissipation: 3.9 W
• Package / Case: QFN-16
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1059496

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Time within 5 °C of Peak Temperature
Recommended Surface Mount Package Assembly
Activation Time and Temperature
• Proper ESD precautions must be followed while handling packages.
• Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
• TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow
• Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot
• Clean the assembly with alcohol.
oven vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles
are listed in the table below.
placement. The volume of solder paste depends on PCB and component layout and should be well
controlled to ensure consistent mechanical and electrical performance.
Time above Melting Point
Max Peak Temperature
Reflow Profile
Ramp-down Rate
Ramp-up Rate
TGA2521-SM, TAPE AND REEL
TriQuint Semiconductor: www. triquint.com [phone] Fax [phone] [e-mail]
Part
Ordering Information
Assembly Notes
60 – 120 sec @ 140 – 160 °C
Feb 2011 © Rev D
Feb 2010 © Rev C
4 – 6 °C/sec
60 – 150 sec
10 – 20 sec
4mm x 4mm QFN Surface Mount, TAPE AND REEL
3 °C/sec
240 °C
SnPb
Package Style
TGA2521-SM
60 – 180 sec @ 150 – 200 °C
4 – 6 °C/sec
60 – 150 sec
10 – 20 sec
Pb Free
3 °C/sec
260 °C
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