AH125-89PCB900 TriQuint, AH125-89PCB900 Datasheet - Page 12

• Manufacturer Part Number: AH125-89PCB900
• Description: RF Modules & Development Tools .4-2.7GHz Eval Board
• Manufacturer: TriQuint

Specifications of AH125-89PCB900

• Board Size: 4.25 mm x 4.6 mm x 1.6 mm
• Minimum Frequency: 400 MHz
• Minimum Operating Temperature: - 40 C
• Supply Voltage (min): 5 V
• Product: RF Modules
• Maximum Frequency: 3.6 GHz
• Supply Voltage (max): 6 V
• Supply Current: 170 mA
• Maximum Operating Temperature: + 85 C
• For Use With/related Products: AH125
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1071315

AH125
½W High Linearity InGaP HBT Amplifier
TriQuint Semiconductor, Inc • Phone [phone] • FAX: [phone] • e-mail: [e-mail] • Web site: www.TriQuint.com
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
YXXX-Z
AH125G
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Mechanical Information
Specifications and information are subject to change without notice
The AH125 will be marked with an
“AH125G” designator with a lot code marked
below the part designator. The “Y” represents
the last digit of the year the part was
manufactured, the “XXX” is an auto-
generated number, and “Z” refers to a wafer
number in a batch.
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
1. Ground / thermal vias are critical for the proper performance of
2. Add as much copper as possible to inner and outer layers near
3. Mounting screws can be added near the part to fasten the board
4. Do not put solder mask on the backside of the PC board in the
5. RF trace width depends upon the PC board material and
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches).
Mounting Config. Notes
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
the part to ensure optimal thermal performance.
to a heatsink.
contacts the heatsink.
region where the board contacts the heatsink.
construction.
degrees.
MSL / ESD Rating
Product Marking
Class 2
Passes
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class IV
Passes ≥ 2000V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
JEDEC Standard J-STD-020
Ensure that the ground / thermal via region
2000V to <4000V
Page 12 of 12 April 2010
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