BGA-3528 OKI METCAL, BGA-3528 Datasheet - Page 8

• Manufacturer Part Number: BGA-3528
• Description: ASSEMBLY MICRO-OVEN 3500 SERIES
• Manufacturer: OKI METCAL
• Series: 3500r

Specifications of BGA-3528

• Accessory Type: Oven
• For Use With/related Products: BGA and CSP Rework systems
• Other names: BGA3528

6
Main Unit Components - Figure 1
11. Open Frame adjustable printed circuit board holder.
12. Main Power Switch.
13. Subzone heater, heat/cool selector switch.
14. BGA-3528 Micro Oven Head Assembly
15. Z-Axis Adjustment Lever – Rotating Clockwise will raise the head assembly, while rotating
16. Component Pick-up Solenoid – When engaged, the vacuum is set to automatically raise the
III. SYSTEM FUNCTIONS
BGA/CSP-3500 SYSTEM - Figure 1 (page 7)
17. Vacuum Cup Height Lock – After the lift solenoid has been armed, this knob locks the vacuum cup
18. Quick-change Nozzle Release / Lock Mechanism
19. Nozzle Rotation Knob – Adjusts the angle at which the nozzle sits in reference to the component
10. Board Holder Position Locking Knob – When placing a component, pull this knob towards you
11. Underboard Support Assembly– Provides support to the printed circuit board and reduces any
12. X-Axis Lock / Unlock Bar – Set into the “horizontal” position to unlock the X-Axis to make coarse
13. Y-Axis Lock / Unlock Bar – Set into the “horizontal” position to unlock the Y-Axis to make coarse
14. X-Axis Micrometer - Used to make fine adjustments to the X-Axis.
15. Y-Axis Micrometer - Used to make fine adjustments to the Y-Axis.
16. Vacuum Contact LED – Illuminates when the removal vacuum is activated AND the vacuum pad is
17. Component Illumination Knob –Varies the amount of light directed to the bottom side terminals of
18. PCB Illumination Knob - Varies the amount of light directed to the top of the PCB. This adjustment
This underboard support is constructed of a special material that reduces the absorption of heat,
however, in some instances it may interfere with the transfer of heat energy from the underboard
heater. Please position it away from the component under rework.
the component. This adjustment affects the illumination of the component viewed on the monitor.
affects the illumination of the PCB pads viewed on the monitor.
counter clockwise will lower the head assembly.
component after reflow.
into position on the component to be removed.
and slide the board holder until it locks securely underneath the Placement arm or reflow head.
potential of PCB warpage or bowing. Adjust the 4 thumbscrews on the underboard support until
they contact the bottom of the PCB and provide support.
adjustments, and then set into the “vertical” position to lock the X-Axis to make fine adjustments
using the micrometer.
adjustments, then set into the “vertical” position to lock the Y-Axis to make fine adjustments using
the micrometer.
in contact with the component.
BGA-3500 Series Manual 5/01