APTM100H80FT1G Microsemi Power Products Group, APTM100H80FT1G Datasheet

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APTM100H80FT1G

Manufacturer Part Number
APTM100H80FT1G
Description
MOSFET MODULE FULL BRIDGE SP1
Manufacturer
Microsemi Power Products Group
Datasheet

Specifications of APTM100H80FT1G

Fet Type
4 N-Channel (H-Bridge)
Fet Feature
Standard
Rds On (max) @ Id, Vgs
960 mOhm @ 9A, 10V
Drain To Source Voltage (vdss)
1000V (1kV)
Current - Continuous Drain (id) @ 25° C
11A
Vgs(th) (max) @ Id
5V @ 1mA
Gate Charge (qg) @ Vgs
150nC @ 10V
Input Capacitance (ciss) @ Vds
3876pF @ 25V
Power - Max
208W
Mounting Type
Chassis Mount
Package / Case
SP1
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Absolute maximum ratings
Symbol
R
V
MOSFET Power Module
V
I
I
P
I
DSon
DM
AR
DSS
D
GS
D
5
7
Drain - Source Breakdown Voltage
Continuous Drain Current
Pulsed Drain current
Gate - Source Voltage
Drain - Source ON Resistance
Maximum Power Dissipation
Avalanche current (repetitive and non repetitive)
Pins 3/4 must be shorted together
11
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
Full - Bridge
Q1
Q2
8
3
6
NTC
1
4
Parameter
10
Q3
Q4
12
2
9
www.microsemi.com
Application
Features
Benefits
V
R
I
D
T
T
T
DSS
DSon
c
c
c
= 11A @ Tc = 25°C
= 25°C
= 80°C
= 25°C
Welding converters
Switched Mode Power Supplies
Uninterruptible Power Supplies
Motor control
Power MOS 8™ Fast FREDFETs
Very low stray inductance
Internal thermistor for temperature monitoring
High level of integration
= 1000V
-
-
-
-
-
-
Outstanding performance at high frequency operation
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Solderable terminals both for power and signal for
easy PCB mounting
Low profile
Each leg can be easily paralleled to achieve a phase
leg of twice the current capability
RoHS Compliant
APTM100H80FT1G
-
= 800mΩ typ @ Tj = 25°C
Low R
Low input and Miller capacitance
Low gate charge
Fast intrinsic reverse diode
Avalanche energy rated
Very rugged
Symmetrical design
Max ratings
DSon
1000
±30
960
208
11
68
8
9
Unit
W
V
A
V
A
1 – 5

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APTM100H80FT1G Summary of contents

Page 1

... Drain - Source ON Resistance DSon P Maximum Power Dissipation D I Avalanche current (repetitive and non repetitive) AR These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com APTM100H80FT1G V = 1000V DSS R = 800mΩ typ @ Tj = 25°C DSon I = 11A @ Tc = 25°C D Application • ...

Page 2

... Diode Forward Voltage SD dv/dt Peak Diode Recovery t Reverse Recovery Time rr Q Reverse Recovery Charge rr dv/dt numbers reflect the limitations of the circuit rather than the device itself. ≤ di/dt ≤ 1000A/µ APTM100H80FT1G = 25°C unless otherwise specified j Test Conditions T = 25° 1000V 125° ...

Page 3

... Symbol Characteristic R Resistance @ 25° 298.15 K 25/ ⎡ ⎢ exp B ⎣ SP1 Package outline (dimensions in mm) See application note 1904 - Mounting Instructions for SP1 Power Modules on www.microsemi.com APTM100H80FT1G To heatsink R T: Thermistor temperature 25 ⎤ ⎛ ⎞ Thermistor value ⎜ ⎜ ⎟ ⎟ − ⎥ ⎝ ...

Page 4

... D 2 1 100 T , Junction Temperature (°C) J Gate Charge vs Gate to Source 12 V =10V =500V 100 120 140 160 Gate Charge (nC) APTM100H80FT1G =125° 12.5 10 7.5 5 2.5 0 125 150 0 Capacitance vs Drain to Source Voltage 10000 V =200V DS 1000 100 V =800V www.microsemi.com Low Voltage Output Characteristics T =125° ...

Page 5

... Microsemi reserves the right to change, without notice, the specifications and information contained herein Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved. APTM100H80FT1G T =25° ...

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