SL3S1002AC2,118 NXP Semiconductors, SL3S1002AC2,118 Datasheet - Page 4

• Manufacturer Part Number: SL3S1002AC2,118
• Description: IC UCODE EPC G2 FCS2
• Manufacturer: NXP Semiconductors

Specifications of SL3S1002AC2,118

• Rf Type: Read / Write
• Frequency: 865MHz ~ 928MHz
• Features: ISO 18000-6C
• Package / Case: Flip-Chip-2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935287639118

NXP Semiconductors
3. Applications
4. Ordering information
157335
Product short data sheet
CONFIDENTIAL
Table 1.
Table 2.
[1]
[2]
Type number
SL3ICS1002FUG/V7AF
SL3S1002FTT
SL3S1002FTB1
SL3S1002AC0
SL3S1002AC2
Type number
SL3ICS1202FUG/V7AF
SL3S1202FTT
SL3S1202FTB1
SL3S1202AC0
SL3S1202AC2
Supply chain management
Item level tagging
Asset management
Container identification
Pallet and case tracking
Product authentication
FCS2 Polymer Strap, JEDEC outline standard Copper
FCS2 Polymer Strap, JEDEC outline standard Aluminum
Ordering information G2XM
Ordering information G2XL
Rev. 3.5 — 2 November 2009
Wafer
Package
Name
TSSOP8
XSON3
FCS2
FCS2
Package
Name
Wafer
TSSOP8
XSON3
FCS2
FCS2
157335
Description
Bumped die on sawn wafer
plastic thin shrink small outline package;
8 leads; body width 3 mm
plastic extremely thin small outline
package;3 terminals;
body 1 x 1.45 x 0,5 mm
plastic flip chip strap package; 2 leads,
9 mm wide tape
plastic flip chip strap package; 2 leads;
9 mm wide tape
Description
Bumped die on sawn wafer
plastic thin shrink small outline package;
8 leads; body width 3 mm
plastic extremely thin small outline
package;3 terminals;
body 1 x 1.45 x 0,5 mm
plastic flip chip strap package; 2 leads,
9 mm wide tape
plastic flip chip strap package; 2 leads;
9 mm wide tape
[1]
[2]
[1]
[2]
SL3ICS1002/1202
UCODE G2XM and G2XL
© NXP B.V. 2009. All rights reserved.
Version
-
SOT505-1
SOT1122
SOT1040-1
SOT1040-1
Version
-
SOT505-1
SOT1122
SOT1040-1
SOT1040-1
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