SL3S1002AC2,118 NXP Semiconductors, SL3S1002AC2,118 Datasheet - Page 21

• Manufacturer Part Number: SL3S1002AC2,118
• Description: IC UCODE EPC G2 FCS2
• Manufacturer: NXP Semiconductors

Specifications of SL3S1002AC2,118

• Rf Type: Read / Write
• Frequency: 865MHz ~ 928MHz
• Features: ISO 18000-6C
• Package / Case: Flip-Chip-2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935287639118

NXP Semiconductors
16. Contents
1
1.1
2
2.1
2.2
2.3
3
4
5
6
6.1
6.2
7
8
9
9.1
9.2
10
10.1
10.1.1
11
12
12.1
12.2
12.3
12.4
13
14
15
16
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Ordering information . . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Wafer layout and pinning information . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 15
G2X Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Air interface standards . . . . . . . . . . . . . . . . . . . 2
Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Custom commands. . . . . . . . . . . . . . . . . . . . . . 3
Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
FCS2 layout strap and pinning . . . . . . . . . . . . . 7
Wafer characteristics . . . . . . . . . . . . . . . . . . . 15
Package characteristics . . . . . . . . . . . . . . . . . 15
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 17
User memory (only G2XM) . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
SL3ICS1002/1202
UCODE G2XM and G2XL
Date of release: 2 November 2009
Document identifier: 157335
All rights reserved.
157335