SL2MOS5401EV,118 NXP Semiconductors, SL2MOS5401EV,118 Datasheet

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SL2MOS5401EV,118

Manufacturer Part Number
SL2MOS5401EV,118
Description
IC I.CODE SLI-S PLLMC
Manufacturer
NXP Semiconductors
Datasheet

Specifications of SL2MOS5401EV,118

Rf Type
Read / Write
Frequency
13.56MHz
Package / Case
PLLMC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Other names
935283749118
1. General description
2. Ordering information
Table 1.
3. Specifications
Type number
SL2MOS5401EV
Ordering information
3.1 Chip
Package
Name
PLLMC
This document gives specifications for the product SL2MOS5401.
Therefore this document encompasses all information not covered by the specification of
the package and/or the functional specification of the integrated circuit.
Functionality of the integrated circuit is described in the “Product data sheet
SL2ICS53/SL2ICS54”.
SL2MOS5401
Addendum contactless chip card module specification
Rev. 3.0 — 15 January 2009
168230
The SL2MOS5401 is the integrated circuit SL2ICS5401 in the package SOT500AA1.
Detailed information on the package is given in the contactless chip card module
specification.
Functionality of the integrated circuit is described in the “Product data sheet
SL2ICS53/SL2ICS54”.
Description
Plastic leadless module carrier package; 35 mm wide tape
Product data sheet
Version
SOT500
PUBLIC

Related parts for SL2MOS5401EV,118

SL2MOS5401EV,118 Summary of contents

Page 1

SL2MOS5401 Addendum contactless chip card module specification Rev. 3.0 — 15 January 2009 168230 1. General description This document gives specifications for the product SL2MOS5401. • The SL2MOS5401 is the integrated circuit SL2ICS5401 in the package SOT500AA1. Therefore this document ...

Page 2

... NXP Semiconductors 4. Limiting values Table 2. In accordance with the Absolute Maximum Rating System (IEC 60134). Processing temperature: refer to “Contactless chip card module specification” Symbol T stg V ESD I max LA-LB T jop I LA-LB [1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device ...

Page 3

... NXP Semiconductors 5. Characteristics 5.1 Electrical characteristics [1] Table 3. Characteristics Symbol Parameter = − ° minimum supply voltage for LA-LB READ/WRITE/EAS f operating frequency op C input capacitance between res LA – minimum operating supply min power m modulation of RF voltage for demodulator response t modulation pulse length Psm ...

Page 4

... NXP Semiconductors 7. Revision history Table 4. Revision history Document ID Release date 168230 20090115 168230 Product data sheet Addendum contactless chip card module specification Data sheet status Change notice Product data sheet - Rev. 3.0 — 15 January 2009 SL2MOS5401 Supersedes - © NXP B.V. 2009. All rights reserved. ...

Page 5

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 6

... NXP Semiconductors 10. Tables Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .1 [1][2] Table 2. Limiting values . . . . . . . . . . . . . . . . . . . . . . .2 11. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 3 Specifications 3.1 Chip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Electrical characteristics . . . . . . . . . . . . . . . . . . 3 6 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Legal information 8.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 5 8.2 Definitions ...

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