SL2MOS5401 NXP Semiconductors, SL2MOS5401 Datasheet

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SL2MOS5401

Manufacturer Part Number
SL2MOS5401
Description
Addendum Contactless Chip Card Module Specification
Manufacturer
NXP Semiconductors
Datasheet
1. General description
2. Ordering information
Table 1.
3. Specifications
Type number
SL2MOS5401EV
Ordering information
3.1 Chip
Package
Name
PLLMC
This document gives specifications for the product SL2MOS5401.
Therefore this document encompasses all information not covered by the specification of
the package and/or the functional specification of the integrated circuit.
Functionality of the integrated circuit is described in the “Product data sheet
SL2ICS53/SL2ICS54”.
SL2MOS5401
Addendum contactless chip card module specification
Rev. 3.0 — 15 January 2009
168230
The SL2MOS5401 is the integrated circuit SL2ICS5401 in the package SOT500AA1.
Detailed information on the package is given in the contactless chip card module
specification.
Functionality of the integrated circuit is described in the “Product data sheet
SL2ICS53/SL2ICS54”.
Description
Plastic leadless module carrier package; 35 mm wide tape
Product data sheet
Version
SOT500
PUBLIC

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SL2MOS5401 Summary of contents

Page 1

... General description This document gives specifications for the product SL2MOS5401. • The SL2MOS5401 is the integrated circuit SL2ICS5401 in the package SOT500AA1. Therefore this document encompasses all information not covered by the specification of the package and/or the functional specification of the integrated circuit. • ...

Page 2

... Product data sheet Addendum contactless chip card module specification [1][2] Limiting values Parameter Conditions storage temperature electrostatic discharge voltage maximum input peak current operating junction temperature input current ). LA-LB Rev. 3.0 — 15 January 2009 SL2MOS5401 Min Max Unit −25 °C +85 ±2 [ peak −60 +60 ...

Page 3

... LA-LB rms [ max min max min [ ≥ 100 % [5] - [5] - ≤ 55 ° amb 100000 Rev. 3.0 — 15 January 2009 SL2MOS5401 Typ Max Unit ± 2.6 ± 2.9 V rms 13.560 13.567 MHz 97 102 pF μW 280 - - - % μ μ Ω year - - cycle © ...

Page 4

... Revision history Table 4. Revision history Document ID Release date 168230 20090115 168230 Product data sheet Addendum contactless chip card module specification Data sheet status Change notice Product data sheet - Rev. 3.0 — 15 January 2009 SL2MOS5401 Supersedes - © NXP B.V. 2009. All rights reserved ...

Page 5

... Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I-CODE — trademark of NXP B.V. http://www.nxp.com salesaddresses@nxp.com Rev. 3.0 — 15 January 2009 SL2MOS5401 © NXP B.V. 2009. All rights reserved ...

Page 6

... Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8.4 Trademarks Contact information Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 SL2MOS5401 Addendum contactless chip card module specification [1] Table 3. Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 3 Table 4. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 4 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. ...

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