ADF7901BRU Analog Devices Inc, ADF7901BRU Datasheet - Page 11

IC XMITTER OOK/FSK ISM 24TSSOP

ADF7901BRU

Manufacturer Part Number
ADF7901BRU
Description
IC XMITTER OOK/FSK ISM 24TSSOP
Manufacturer
Analog Devices Inc
Datasheet

Specifications of ADF7901BRU

Frequency
369.5 ~ 395.9MHz
Applications
ISM
Modulation Or Protocol
ASK, FSK, OOK
Data Rate - Maximum
50 kbps
Power - Output
7dBm ~ 12dBm
Current - Transmitting
26mA
Data Interface
PCB, Surface Mount
Antenna Connector
PCB, Surface Mount
Voltage - Supply
3V
Operating Temperature
0°C ~ 50°C
Package / Case
24-TSSOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADF7901BRU
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
ADF7901BRUZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
ADF7901BRUZ-RL7
Manufacturer:
AD
Quantity:
7 793
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADF7901BRU
ADF7901BRU-REEL
ADF7901BRU-REEL7
ADF7901BRUZ
ADF7901BRUZ-RL
ADF7901BRUZ-RL7
EVAL-ADF7901EB
1
Z = Pb-free part.
1
1
1
Temperature Range
0°C to 50°C
0°C to 50°C
0°C to 50°C
0°C to 50°C
0°C to 50°C
0°C to 50°C
0.15
0.05
PIN 1
0.10 COPLANARITY
Figure 9. 24-Lead Thin Shrink Small Outline Package [TSSOP]
24
1
COMPLIANT TO JEDEC STANDARDS MO-153AD
BSC
0.65
0.30
0.19
7.90
7.80
7.70
Dimensions shown in millimeters
Rev. A| Page 11 of 12
Package Description
24-Lead Thin Shrink Small Outline Package (TSSOP)
24-Lead Thin Shrink Small Outline Package (TSSOP)
24-Lead Thin Shrink Small Outline Package (TSSOP)
24-Lead Thin Shrink Small Outline Package (TSSOP)
24-Lead Thin Shrink Small Outline Package (TSSOP)
24-Lead Thin Shrink Small Outline Package (TSSOP)
Evaluation Board
SEATING
PLANE
(RU-24)
13
12
MAX
1.20
4.50
4.40
4.30
0.20
0.09
6.40 BSC
0.75
0.60
0.45
Package Option
RU-24
RU-24
RU-24
RU-24
RU-24
RU-24
ADF7901

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