XB24-BUIT-004 Digi International/Maxstream, XB24-BUIT-004 Datasheet - Page 9

• Manufacturer Part Number: XB24-BUIT-004
• Description: MODULE 802.15.4 SER 2 U.FL CONN
• Manufacturer: Digi International/Maxstream
• Series: XBee™r

Specifications of XB24-BUIT-004

• Frequency: 2.4GHz
• Data Rate - Maximum: 250kbps
• Modulation Or Protocol: 802.15.4
• Applications: Home/Building Automation, Industrial Control, ZigBee™
• Power - Output: 2 mW (3 dBm)
• Sensitivity: -96dBm
• Voltage - Supply: 2.1 V ~ 3.6 V
• Current - Receiving: 38mA
• Current - Transmitting: 35mA
• Data Interface: PCB, Through Hole
• Antenna Connector: U.FL
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Module
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Memory Size: -

XBee /XBee‐PRO ZNet 2.5 ZigBee OEM RF Modules v1.x4x
1.4. Mounting Considerations
The XBee modules were designed to mount into a receptacle (socket) and therefore does not
require any soldering when mounting it to a board. The XBee PRO ZNet 2.5 Development Kits
contain RS-232 and USB interface boards which use two 20-pin receptacles to receive modules.
Figure 1‐03. XBee PRO ZNet 2.5 Module Mounting to an RS‐232 Interface Board.
The receptacles used on Digi development boards are manufactured by Century Interconnect.
Several other manufacturers provide comparable mounting solutions; however, Digi currently uses
the following receptacles:
Digi also recommends printing an outline of the module on the board to indicate the orientation the
module should be mounted.
© 2008 Digi International, Inc.
• Through-hole single-row receptacles -
• Surface-mount double-row receptacles -
• Surface-mount single-row receptacles -
Samtec P/N: MMS-110-01-L-SV (or equivalent)
Century Interconnect P/N: CPRMSL20-D-0-1 (or equivalent)
Samtec P/N: SMM-110-02-SM-S
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