LTC4557EUD Linear Technology, LTC4557EUD Datasheet - Page 11

• Manufacturer Part Number: LTC4557EUD
• Description: IC DUAL SIM/SMART CARD PS 16QFN
• Manufacturer: Linear Technology

Specifications of LTC4557EUD

• Function: Power Management, Signal Level Translation
• Rf Type: Cellular, 3G, GSM
• Secondary Attributes: SIM & Smart Card Interface
• Package / Case: 16-WFQFN Exposed Pad
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

PACKAGE DESCRIPTIO
3.50 0.05
2.10 0.05
1.45 0.05
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
U
3.00 0.10
(4 SIDES)
16-Lead Plastic QFN (3mm 3mm)
(Reference LTC DWG # 05-08-1691)
0.50 BSC
0.25 0.05
0.70 0.05
UD Package
PACKAGE OUTLINE
0.75 0.05
1.45 0.10
(4-SIDES)
0.200 REF
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
15 16
(4 SIDES)
0.23 TYP
0.50 BSC
0.25 0.05
1
2
(UD) QFN 0603
0.40 0.10
LTC4557
11
4557f