XB24-BPDK Digi International/Maxstream, XB24-BPDK Datasheet - Page 9

Manufacturer Part Number

XB24-BPDK

Description

KIT DEVELOPMENT XBEE SERIES 2

Manufacturer

Digi International/Maxstream

Series

XBee™r

Type

802.15.4/Zigbeer

Datasheet

1.XB24-BPDK.pdf (91 pages)

Frequency

2.4GHz

For Use With/related Products

XBee™ Series 2 Modules

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

XBee /XBee‐PRO ZNet 2.5 ZigBee OEM RF Modules v1.x4x

1.4. Mounting Considerations

The XBee modules were designed to mount into a receptacle (socket) and therefore does not

require any soldering when mounting it to a board. The XBee PRO ZNet 2.5 Development Kits

contain RS-232 and USB interface boards which use two 20-pin receptacles to receive modules.

Figure 1‐03. XBee PRO ZNet 2.5 Module Mounting to an RS‐232 Interface Board.

The receptacles used on Digi development boards are manufactured by Century Interconnect.

Several other manufacturers provide comparable mounting solutions; however, Digi currently uses

the following receptacles:

Digi also recommends printing an outline of the module on the board to indicate the orientation the

module should be mounted.

• Through-hole single-row receptacles -

• Surface-mount double-row receptacles -

• Surface-mount single-row receptacles -

Samtec P/N: MMS-110-01-L-SV (or equivalent)

Century Interconnect P/N: CPRMSL20-D-0-1 (or equivalent)

Samtec P/N: SMM-110-02-SM-S