EM250-BBRD-R Ember, EM250-BBRD-R Datasheet - Page 110
EM250-BBRD-R
Manufacturer Part Number
EM250-BBRD-R
Description
EM250 BREAKOUT BOARD
Manufacturer
Ember
Type
Transceiver, 802.15.4r
Datasheet
1.EM250-RCM-R.pdf
(126 pages)
Specifications of EM250-BBRD-R
Frequency
2.4GHz
For Use With/related Products
EM250
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
636-1024
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EM250
8 Mechanical Details
120-0082-000S
2x
2x
Nx
The EM250 package is a plastic 48-pin QFN that is 7mm x 7mm x 0.9mm. Figure 17 and Figure 18 illustrate the
package dimensions for the EM250s. Please see Chapter 11 for more information about how to determine the
assembly site.
A
Figure 17. Package Drawing for EM250s assembled in Wales or China
Figure 18: Package Drawing for EM250s assembled in Malaysia
Detail B
Top View
Edge View
D
4
Detail B
E
E1 E2
0.4000
0.4000
R
0.15 typ
nx b
Bottom View
L1
Detail A
D2
D1
e
7
Page 110
6
Detail A
EXPOSED
PAD
Pin 1
3
Notes
1. JEDEC ref MO-220
2. All dimensions are in millimeters
3. Pin 1 orientation identified by chamfer on corner of
exposed die pad.
4. Datum C and the seating plane are defined by the flat surface
of the metallised terminal
5. Dimension 'e' represents the terminal pitch
6. Dimension b applies to metallised terminal and is measured
0.25 to 0.30mm from terminal tip.
7. Dimension L1 represents terminal pull back from package
edge. Where terminal pull back exists, only upper half of lead is
visible on package edge due to half etching of leadframe.
8. Package surface shall be matte finish , Ra 1.6 - 2.2
9. Package warp shall be 0.050 maximum
10. Leadframe material is copper A194.
11. Coplanarity applies to the exposed pad as well as the
terminals.
Sym.
A1
A3
D1
D2
E1
E2
L1
A
D
E
L
b
N
e
k
R
T
Common Dimensions (mm)
Sym.
Minimum
b min / 2
aaa
bbb
ccc
0.80
0.85
6.90
5.20
6.90
5.20
0.35
0.18
0.2
0
Form & Position
Tolerances for
0.15
0.10
0.10
Nominal
0.20 ref
0.90
0.02
7.00
5.30
7.00
5.30
0.40
0.23
0.50
0.15
5.5
5.5
48
Notes
Maximum
0.05
7.10
5.40
7.10
5.40
0.45
0.30
1.0
0.1
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