M5373EVB Freescale Semiconductor, M5373EVB Datasheet - Page 40

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M5373EVB

Manufacturer Part Number
M5373EVB
Description
KIT EVAL FOR MCF537X
Manufacturer
Freescale Semiconductor
Series
ColdFire®r
Type
MPUr
Datasheet

Specifications of M5373EVB

Contents
Module and Misc Hardware
For Use With/related Products
MCF537x
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Package Information
7.1
Figure 31
40
196X
13X
3
e
X
E
shows the MCF5373LCVM240, MCF5372LCVM240, and MCF53721CVM240 package dimensions.
Y
b
0.30
0.10 Z
S
Package Dimensions—196 MAPBGA
0.20
Z
14 13 12 11
X
Y
Laser mark for pin 1
identification in
this area
Figure 31. 196 MAPBGA Package Dimensions (Case No. 1128A-01)
10
Bottom View
Top View
9
View M-M
MCF537x ColdFire
D
6
13X
S
5
e
4
3
2
®
1
Microprocessor Data Sheet, Rev. 4
A
B
C
D
G
H
K
M
N
E
F
J
L
P
Metalized mark for
pin 1 identification
in this area
K
M
M
A
A2
A1
Rotated 90 Clockwise
NOTES:
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances
3. Dimension B is measured at the
4. Datum Z (seating plane) is defined
5. Parallelism measurement shall
per ASME Y14.5M, 1994.
maximum solder ball diameter,
parallel to datum plane Z.
by the spherical crowns of the solder
balls.
exclude any effect of mark on top
surface of package.
Z
DIM
A1 0.27 0.47
A2 1.18 REF
Detail K
A 1.32 1.75
D 15.00 BSC
b 0.35 0.65
E 15.00 BSC
e
S
4
°
Min Max
Millimeters
1.00 BSC
0.50 BSC
Freescale Semiconductor
0.15 Z
0.30 Z
5

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