SC16C750IA44,512 NXP Semiconductors, SC16C750IA44,512 Datasheet - Page 42

• Manufacturer Part Number: SC16C750IA44,512
• Description: IC UART 64BYTE 44PLCC
• Manufacturer: NXP Semiconductors

Specifications of SC16C750IA44,512

• Number Of Channels: 1, UART
• Fifo's: 64 Byte
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• With Cmos: Yes
• Mounting Type: Surface Mount
• Package / Case: 44-PLCC
• Voltage: 2.25 V ~ 5.5 V
• Transmit Fifo: 64Byte
• Receive Fifo: 64Byte
• Transmitter And Receiver Fifo Counter: Yes
• Package Type: PLCC
• Operating Supply Voltage (max): 5.5V
• Mounting: Surface Mount
• Pin Count: 44
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 935270053512; SC16C750IA44; SC16C750IA44

Philips Semiconductors
9397 750 11623
Product data
12.4 Manual soldering
12.5 Package related soldering information
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or
265 C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in
most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300 C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320 C.
Table 27:
[1]
[2]
Package
BGA, LBGA, LFBGA, SQFP, SSOP-T
TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP,
HSOP, HTQFP, HTSSOP, HVQFN, HVSON,
SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
•
•
For packages with leads on two sides and a pitch (e):
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45 angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
For more detailed information on the BGA packages refer to the (LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods .
parallel to the transport direction of the printed-circuit board;
transport direction of the printed-circuit board.
[5]
, SO, SOJ
[1]
Suitability of surface mount IC packages for wave and reflow soldering
methods
Rev. 04 — 20 June 2003
[3]
,
Soldering method
Wave
not suitable
not suitable
suitable
not recommended
not recommended
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
[4]
UART with 64-byte FIFO
[5][6]
[7]
SC16C750
Reflow
suitable
suitable
suitable
suitable
suitable
[2]
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