SI5499DC-T1-GE3 Vishay, SI5499DC-T1-GE3 Datasheet - Page 3

MOSFET P-CH D-S 1.5V 1206-8

SI5499DC-T1-GE3

Manufacturer Part Number
SI5499DC-T1-GE3
Description
MOSFET P-CH D-S 1.5V 1206-8
Manufacturer
Vishay
Series
TrenchFET®r
Datasheet

Specifications of SI5499DC-T1-GE3

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
36 mOhm @ 5.1A, 4.5V
Drain To Source Voltage (vdss)
8V
Current - Continuous Drain (id) @ 25° C
6A
Vgs(th) (max) @ Id
800mV @ 250µA
Gate Charge (qg) @ Vgs
35nC @ 8V
Input Capacitance (ciss) @ Vds
1290pF @ 4V
Power - Max
6.2W
Mounting Type
Surface Mount
Package / Case
1206-8 ChipFET™
Transistor Polarity
P Channel
Continuous Drain Current Id
-6A
Drain Source Voltage Vds
-8V
On Resistance Rds(on)
77mohm
Rds(on) Test Voltage Vgs
5V
Threshold Voltage Vgs Typ
-550mV
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
SI5499DC-T1-GE3TR
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Document Number: 73321
S-83054-Rev. C, 29-Dec-08
SPECIFICATIONS T
Parameter
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
J
= 25 °C, unless otherwise noted
Symbol
V
I
Q
I
SM
t
t
t
SD
S
rr
a
b
rr
I
F
= - 5.6 A, dI/dt = 100 A/µs, T
I
S
= - 2.1 A, V
Test Conditions
T
C
= 25 °C
GS
= 0 V
J
= 25 °C
Min.
Typ.
- 0.7
45
18
18
17
Vishay Siliconix
Si5499DC
Max.
- 1.2
- 25
- 6
70
27
www.vishay.com
Unit
nC
ns
ns
A
V
3

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