LCP02-150M STMicroelectronics, LCP02-150M Datasheet - Page 8

• Manufacturer Part Number: LCP02-150M
• Description: IC PROTECTION SLIC POWERSO-10
• Manufacturer: STMicroelectronics

Specifications of LCP02-150M

• Technology: Mixed Technology
• Number Of Circuits: 1
• Applications: SLIC
• Package / Case: PowerSO-10 Exposed Bottom Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Voltage - Working: -
• Voltage - Clamping: -

Package information
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8/10
Package information
Table 8.
Figure 8.
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
A1
H
A
E4
F
E
h
10
0.25 M
1
e
PowerSO-10 Dimensions
Footprint (dimensions in mm)
D1
D
6
5
B
E2
DETAIL "A"
DETAIL "A"
Q
E3 E1
B
0.10 A B
SEATING
A
C
a
PLANE
1.27
A1
SEATING
PLANE
L
9.5
0.54 - 0.60
Ref.
D1
A1
E1
E2
E3
E4
Q
0.67 - 0.73
A
B
C
D
E
H
e
F
h
L
a
13.80
Min.
3.35
0.00
0.40
0.35
9.40
7.40
9.30
7.20
7.20
6.10
5.90
1.25
1.20
0°
Millimeters
Typ.
1.27
0.50
1.70
14.40 0.543
Dimensions
Max.
3.65 0.131
0.10
0.60 0.016
0.55 0.014
9.60 0.370
7.60 0.291
9.50 0.366
7.40 0.283
7.60 0.283
6.35 0.240
6.10 0.232
1.35 0.049
1.80 0.047
8°
Min.
0.00
0°
LCP02-150M
Inches
0.019
0.067
Typ.
0.05
0.143
0.004
0.024
0.022
0.378
0.299
0.374
0.291
0.299
0.250
0.240
0.053
0.567
0.071
Max.
8°