LT1995IDD#PBF Linear Technology, LT1995IDD#PBF Datasheet - Page 19

• Manufacturer Part Number: LT1995IDD#PBF
• Description: IC AMP GAIN SELECT 10-DFN
• Manufacturer: Linear Technology

Specifications of LT1995IDD#PBF

• Amplifier Type: Programmable Gain
• Number Of Circuits: 1
• Slew Rate: 1000 V/µs
• -3db Bandwidth: 32MHz
• Voltage - Input Offset: 750µV
• Current - Supply: 7.1mA
• Current - Output / Channel: 120mA
• Voltage - Supply, Single/dual (±): 5 V ~ 30 V, ±2.5 V ~ 15 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-WFDFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• Gain Bandwidth Product: -
• Current - Input Bias: -

PACKAGE DESCRIPTIO
3.50 ±0.05
(.0120 ± .0015)
0.305 ± 0.038
2.15 ±0.05
TYP
(.206)
5.23
MIN
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
RECOMMENDED SOLDER PAD LAYOUT
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.25 ± 0.05
1.65 ±0.05
(2 SIDES)
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
2.38 ±0.05
(2 SIDES)
0.889 ± 0.127
(.035 ± .005)
(.126 – .136)
3.20 – 3.45
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
(.0197)
0.50
BSC
0.50
BSC
U
0.675 ±0.05
PACKAGE
OUTLINE
GAUGE PLANE
(.007)
0.18
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
(Reference LTC DWG # 05-08-1661)
(SEE NOTE 6)
TOP MARK
10-Lead Plastic MSOP
(.010)
0.254
PIN 1
0.200 REF
DD Package
MS Package
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
TOP AND BOTTOM OF PACKAGE
DETAIL “A”
DETAIL “A”
0 ° – 6 ° TYP
(.021 ± .006)
0.53 ± 0.152
SEATING
PLANE
0.75 ±0.05
3.00 ±0.10
(4 SIDES)
(.118 ± .004)
3.00 ± 0.102
(.007 – .011)
0.00 – 0.05
(.193 ± .006)
0.17 – 0.27
4.90 ± 0.152
(NOTE 3)
TYP
1.65 ± 0.10
(2 SIDES)
(.043)
MAX
1.10
(.0197)
BOTTOM VIEW—EXPOSED PAD
0.50
10
BSC
1 2 3 4 5
9
8
5
R = 0.115
6
7 6
2.38 ±0.10
(2 SIDES)
TYP
(.118 ± .004)
3.00 ± 0.102
(.0196 ± .003)
0.497 ± 0.076
LT1995
(.034)
(NOTE 4)
0.86
10
REF
0.127 ± 0.076
(.005 ± .003)
1
MSOP (MS) 0603
0.50 BSC
REF
0.25 ± 0.05
0.38 ± 0.10
19
(DD10) DFN 1103
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