LMC6036IM/NOPB National Semiconductor, LMC6036IM/NOPB Datasheet - Page 20

• Manufacturer Part Number: LMC6036IM/NOPB
• Description: IC OP AMP 2.7V SUPP CMOS 14-SOIC
• Manufacturer: National Semiconductor
• Type: General Purpose Amplifierr

Specifications of LMC6036IM/NOPB

• Amplifier Type: General Purpose
• Number Of Circuits: 4
• Output Type: Rail-to-Rail
• Slew Rate: 1.5 V/µs
• Gain Bandwidth Product: 1.4MHz
• Current - Input Bias: 0.02pA
• Voltage - Input Offset: 500µV
• Current - Supply: 1.3mA
• Current - Output / Channel: 8mA
• Voltage - Supply, Single/dual (±): 2 V ~ 15.5 V, ±1 V ~ 7.75 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Rail/rail I/o Type: Rail to Rail Output
• Number Of Elements: 4
• Unity Gain Bandwidth Product: 1.4MHz
• Common Mode Rejection Ratio: 63dB
• Input Offset Voltage: 5mV
• Single Supply Voltage (typ): 3/5/9/12/15V
• Dual Supply Voltage (typ): Not RequiredV
• Voltage Gain In Db: 126.02dB
• Power Supply Rejection Ratio: 63dB
• Power Supply Requirement: Single
• Shut Down Feature: No
• Single Supply Voltage (min): 2V
• Single Supply Voltage (max): 15.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Technology: CMOS
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 14
• Package Type: SOIC N
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Compliant
• Other names: *LMC6036IM; *LMC6036IM/NOPB; LMC6036IM

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
Physical Dimensions
NOTE: UNLESS OTHERWISE SPECIFIED.
1. EPOXY COATING.
2. 63Sn/37Pb EUTECTIC BUMP.
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION PINS ARE NUMBERED COUNTERCLOCKWISE.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
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systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
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inches (millimeters) unless otherwise noted (Continued)
X
1
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8-Bump Thin micro SMD (12 mil bumps)
= 1.717mm X
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NS Package Number TLA08JQA
2
= 1.869mm X
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
3
= 0.600mm
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