MC9S08DZ60CLF Freescale Semiconductor, MC9S08DZ60CLF Datasheet - Page 25
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MC9S08DZ60CLF
Manufacturer Part Number
MC9S08DZ60CLF
Description
IC MCU 60K FLASH 4K RAM 48-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Specifications of MC9S08DZ60CLF
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
For Use With
DEMO9S08DZ60 - BOARD DEMOEVB9S08DZ60 - BOARD EVAL FOR 9S08DZ60
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08DZ60CLF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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EXTAL
Freescale Semiconductor
* The fixed frequency clock (FFCLK) is internally
synchronized to the bus clock and must not exceed one half
of the bus clock frequency.
XOSC
MCG
1 kHZ
LPO
XTAL
MCGFFCLKVALID
MCGERCLK
MCGIRCLK
MCGFFCLK
MCGOUT
MCGLCLK
CPU
Figure 1-2. MC9S08DZ60 System Clock Distribution Diagram
÷
÷
2
2
BUSCLK
RTC
MC9S08DZ60 Series Data Sheet, Rev. 4
1
0
COP
BDC
TPM1CLK
TPM1
FFCLK*
TPM2CLK
TPM2
IIC
ADC has min and
max frequency
requirements.See
the ADC chapter and
electricals appendix
for details.
ADC
SCI1
MSCAN
Chapter 1 Device Overview
SCI2
Flash and
EEPROM have
frequency
requirements for
program and
erase operation.
See the
electricals
appendix for
details.
FLASH
SPI
EEPROM
25
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