STR911FM44X6 STMicroelectronics, STR911FM44X6 Datasheet - Page 55
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STR911FM44X6
Manufacturer Part Number
STR911FM44X6
Description
MCU 512K FLASH 96K SRAM USB CAN
Manufacturer
STMicroelectronics
Series
STR9r
Datasheet
1.STR910FM32X6.pdf
(73 pages)
Specifications of STR911FM44X6
Core Processor
ARM9
Core Size
32-Bit
Speed
96MHz
Connectivity
CAN, I²C, Microwire, SPI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number Of I /o
40
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 2 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-LQFP
For Use With
MCBSTR9UME - BOARD EVAL MCBSTR9 + ULINK-MEMCBSTR9U - BOARD EVAL MCBSTR9 + ULINK2MCBSTR9 - BOARD EVAL STM STR9 SERIES
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
497-5061
497-5061-2
497-5061-2
STR911FM44X6T
497-5061-2
497-5061-2
STR911FM44X6T
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
STR91xF
6.11.3 Absolute Maximum Ratings (Electrical Sensitivity)
6.11.4 Electro-Static Discharge (ESD)
Notes:
1. Data based on characterization results, not tested in production.
6.11.5 Static and Dynamic Latch-Up
6.11.6 Designing hardened software to avoid noise problems
Based on three different tests (ESD, LU and DLU) using specific measurement methods, the
product is stressed in order to determine its performance in terms of electrical sensitivity. For
more details, refer to the application note AN1181.
Electro-Static Discharges (3 positive then 3 negative pulses separated by 1 second) are
applied to the pins of each sample according to each pin combination. The sample size
depends on the number of supply pins in the device (3 parts*(n+1) supply pin). Two models can
be simulated: Human Body Model and Charge Device Model. This test conforms to the
JESD22-A114A/A115A standard.
Table 19.
●
●
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations:
The software flowchart must include the management of runaway conditions such as:
●
●
V
V
ESD(HBM)
ESD(CDM)
Symbol
LU: 3 complementary static tests are required on 10 parts to assess the latch-up
performance. A supply overvoltage (applied to each power supply pin) and a current
injection (applied to each input, output and configurable I/O pin) are performed on each
sample. This test conforms to the EIA/JESD 78 IC latch-up standard. For more details,
refer to the application note AN1181.
DLU: Electro-Static Discharges (one positive then one negative test) are applied to each
pin of 3 samples when the micro is running to assess the latch-up performance in dynamic
mode. Power supplies are set to the typical values, the oscillator is connected as near as
possible to the pins of the micro and the component is put in reset mode. This test
conforms to the IEC1000-4-2 and SAEJ1752/3 standards. For more details, refer to the
application note AN1181.
Corrupted program counter
Unexpected reset
ESD Absolute Maximum ratings
Electro-static discharge voltage
(Human Body Model)
Electro-static discharge voltage
(Charge Device Model)
Ratings
T
A
=+25°C
Conditions
Electrical characteristics
Maximum
value
+/-2000
1000
1)
Unit
55/73
V