DS5003FPM-16+ Maxim Integrated Products, DS5003FPM-16+ Datasheet - Page 7

• Manufacturer Part Number: DS5003FPM-16+
• Description: IC MICROPROCESSOR SECURE 80-MQFP
• Manufacturer: Maxim Integrated Products
• Series: DS500xr

Specifications of DS5003FPM-16+

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: EBI/EMI, SIO, UART/USART
• Peripherals: Power-Fail Reset, WDT
• Number Of I /o: 32
• Program Memory Type: SRAM
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 80-MQFP, 80-PQFP
• Processor Series: DS5003
• Core: 8051
• Data Bus Width: 8 bit
• Program Memory Size: 32 KB, 64 KB, 128 KB
• Data Ram Size: 32 KB, 64 KB, 128 KB
• Interface Type: UART
• Maximum Clock Frequency: 16 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 2
• Operating Supply Voltage: 4.5 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

AC CHARACTERISTICS—PROG
(V
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
Note 6:
Note 7:
Note 8:
Note 9:
Note 10: V
Note 11: SDI is deglitched to prevent accidental destruction. The pulse must be longer than t
Note 12: Crystal startup time is the time required to get the mass of the crystal into vibrational motion from the time that power is
Figure 1. Expanded Data Memory Read Cycle
PROG Low to Active
PROG High to Inactive
CC
PORT 0
PORT 2
= 5V ±10%, T
ALE
RD
All voltages are referenced to ground.
Maximum operating I
XTAL2 disconnected; RST = Port 0 = V
Idle mode, I
disconnected; Port 0 = V
Stop mode, I
XTAL1 = V
Pin capacitance is measured with a test frequency: 1MHz, T
tion tested.
V
I
I
≤ 4.0; V
PF pin operation is specified with V
not guaranteed unless it is longer than t
first applied to the circuit until the first clock pulse is produced by the on-chip oscillator. The user should check with the
crystal vendor for a worst-case specification on this time.
CCO1
LI
CCO2
IHS
is the current drawn from the V
minimum is 2.0V or V
is the maximum average operating current that can be drawn from V
is measured with V
CC
A
PARAMETER
_______________________________________________________________________________________
= 0°C to +70°C.)
SS
≤ V
IDLE
STOP
.
BAT
, is measured with all output pins disconnected; XTAL1 driven with t
t
, is measured with all output pins disconnected; Port 0 = V
; V
ALPW
t
AVALL
SDI
(Rn OR DPL)
CC
A7–A0
should be ≤ V
is measured with all output pins disconnected; XTAL1 driven with t
CC
t
AVRDL
CCO
CC
, RST = MSEL = V
< V
, whichever is lower.
t
AVAAV
t
ALLRDL
LI
LI
BAT
and a maximum load of 10µA on V
t
input when V
AVDV
P2.7–P2.0 OR A15–A8 FROM DPH
ILS
CC
≥ 3.0V.
SPA
for I
, MSEL = V
t
ALLVD
.
Secure Microprocessor Chip
BAT
SS
t
.
RDLDV
CC
SYMBOL
max.
t
RDLAZ
t
t
= 0V and V
PRA
PRI
SS
t
RDPW
.
A
t
= +25°C. This specification is characterized but not produc-
RDHDV
DATA IN
CCO
is disconnected. Battery-backed mode is 2.5V ≤ V
CCO
t
RDHDZ
MIN
t
RDHALH
48
48
.
CCO
CC
; XTAL2 not connected; RST = MSEL =
in normal operation.
CLKR
SPR
to pass the deglitcher, but SDI is
, t
CLKF
CLKR
A7–A0
(PCL)
MAX
A15–A8 FROM PCH
, t
= 10ns, V
CLKF
= 10ns, V
IL
= 0.5V; XTAL2
INSTR
Clocks
Clocks
UNITS
IN
IL
= 0.5V;
BAT
7