SAF-XC164N-32F40F BB Infineon Technologies, SAF-XC164N-32F40F BB Datasheet - Page 54

• Manufacturer Part Number: SAF-XC164N-32F40F BB
• Description: IC MCU 16BIT FLASH 100-TQFP
• Manufacturer: Infineon Technologies
• Series: XC16xr

Specifications of SAF-XC164N-32F40F BB

• Core Processor: C166SV2
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: EBI/EMI, SPI, UART/USART
• Peripherals: PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 2.7 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LFQFP
• Packages: PG-TQFP-100
• Max Clock Frequency: 40.0 MHz
• Sram (incl. Cache): 12.0 KByte
• Program Memory: 256.0 KByte
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Other names: SP000277080

1) An output current above |
Table 13
Parameter
Power supply current (active)
with all peripherals active
Pad supply current
Idle mode supply current
with all peripherals active
Sleep and Power down mode
supply current caused by
leakage
Sleep and Power down mode
supply current caused by
leakage and the RTC running,
clocked by the main oscillator
1) During Flash programming or erase operations the supply current is increased by max. 5 mA.
2) The supply current is a function of the operating frequency. This dependency is illustrated in
3) The pad supply voltage pins (
4) The total supply current in Sleep and Power down mode is the sum of the temperature dependent leakage
5) This parameter is determined mainly by the transistor leakage currents. This current heavily depends on the
6) All inputs (including pins configured as inputs) at 0 V to 0.1 V or at
7) This parameter is determined mainly by the current consumed by the oscillator switched to low gain mode (see
Data Sheet
For any group of 16 neighboring port output pins the total output current in each direction (Σ
remain below 50 mA.
These parameters are tested at
all inputs at
amount of current is consumed even though no outputs are driven, because the drivers’ input stages are
switched and also the Flash module draws some power from the
current and the frequency dependent current for RTC and main oscillator (if active).
junction temperature (see
if no current flows through the port output drivers. Otherwise, the resulting temperature difference must be
taken into account.
pins configured as outputs) disconnected. This parameter is tested at 25 °C and is valid for
Figure
given values refer to a typical circuitry and may change in case of a not optimized external oscillator circuitry.
4)
11). This current, however, is influenced by the external oscillator circuitry (crystal, capacitors). The
V
IL
Power Consumption XC164N (Operating Conditions apply)
or
V
IH
.
I
Figure
OXnom
V
DDP
| may be drawn from up to three pins at the same time.
V
DDImax
12). The junction temperature
4)
) mainly provides the current consumed by the pin output drivers. A small
Sym-
bol
I
I
I
I
I
and maximum CPU clock frequency with all outputs disconnected and
DDI
DDP
IDX
PDL
PDM
5)
7)
Min.
–
–
–
–
–
52
Limit Values
Max.
10 +
3.0 ×
5
10 +
1.3 ×
128,000
× e
0.6 +
0.02 ×
+
I
PDL
-α
T
J
V
f
f
is the same as the ambient temperature
CPU
CPU
V
DDP
f
OSC
DDP
supply.
- 0.1 V to
Unit Test Condition
mA
mA
mA
mA
mA
Electrical Parameters
V
DDP
f
3)
f
V
T
α =
4670 / (273 +
V
f
CPU
CPU
OSC
J
DDI
DDI
, all outputs (including
in [°C]
in [MHz]
in [MHz]
I
in [MHz]
=
=
OL
Derivatives
XC164N-32
T
V
V
V1.0, 2006-08
Figure
and Σ-
J
DDImax
DDImax
≥ 25 °C.
I
OH
1)2)
2)
10.
6)
T
) must
J
)
T
A