C8051F130-GQR Silicon Laboratories Inc, C8051F130-GQR Datasheet - Page 41
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C8051F130-GQR
Manufacturer Part Number
C8051F130-GQR
Description
IC 8051 MCU 128K FLASH 100TQFP
Manufacturer
Silicon Laboratories Inc
Series
C8051F13xr
Specifications of C8051F130-GQR
Core Processor
8051
Core Size
8-Bit
Speed
100MHz
Connectivity
EBI/EMI, SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o
64
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8.25K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Processor Series
C8051F1x
Core
8051
Data Bus Width
8 bit
Data Ram Size
8.25 KB
Interface Type
I2C, SMBus, SPI, UART
Maximum Clock Frequency
100 MHz
Number Of Programmable I/os
64
Number Of Timers
5
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F120DK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C8051F130-GQR
Manufacturer:
TI
Quantity:
679
Company:
Part Number:
C8051F130-GQR
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
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4.
MONEN
DGND
XTAL1
XTAL2
AGND
Pinout and Package Definitions
Name
TMS
TDO
TCK
RST
V
AV+
TDI
DD
64, 90
63, 89
11, 14
10, 13
‘F120
‘F122
‘F124
‘F126
37,
38,
26
27
28
1
2
3
4
5
Pin Numbers
41, 57
40, 56
‘F121
‘F123
‘F125
‘F127
24,
25,
58
59
60
61
62
17
18
19
6
5
64, 90
63, 89
10, 13
11, 14
‘F130
‘F132
37,
38,
26
27
28
1
2
3
4
5
Table 4.1. Pin Definitions
41, 57
40, 56
‘F131
‘F133
24,
25,
58
59
60
61
62
17
18
19
6
5
Rev. 1.4
D Out JTAG Test Data Output with internal pullup. Data
A Out Crystal Output. This pin is the excitation driver
D I/O Device Reset. Open-drain output of internal V
Type
D In JTAG Test Mode Select with internal pullup.
D In JTAG Test Clock with internal pullup.
D In JTAG Test Data Input with internal pullup. TDI is
A In Crystal Input. This pin is the return for the inter-
D In V
C8051F120/1/2/3/4/5/6/7
Digital Supply Voltage. Must be tied to +2.7 to
+3.6 V.
Digital Ground. Must be tied to Ground.
Analog Supply Voltage. Must be tied to +2.7 to
+3.6 V.
Analog Ground. Must be tied to Ground.
latched on the rising edge of TCK.
is shifted out on TDO on the falling edge of TCK.
TDO output is a tri-state driver.
monitor. Is driven low when V
MONEN is high. An external source can initiate
a system reset by driving this pin low.
nal oscillator circuit for a crystal or ceramic reso-
nator. For a precision internal clock, connect a
crystal or ceramic resonator from XTAL1 to
XTAL2. If overdriven by an external CMOS
clock, this becomes the system clock.
for a crystal or ceramic resonator.
enables the internal V
system reset when V
low, the internal V
This pin must be tied high or low.
DD
Monitor Enable. When tied high, this pin
C8051F130/1/2/3
Description
DD
DD
monitor is disabled.
DD
is < V
monitor, which forces a
DD
RST
is < V
. When tied
RST
and
DD
41
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