MCF5212CAE66 Freescale Semiconductor, MCF5212CAE66 Datasheet - Page 28

IC MCU 256K FLASH 66MHZ 64-LQFP

MCF5212CAE66

Manufacturer Part Number
MCF5212CAE66
Description
IC MCU 256K FLASH 66MHZ 64-LQFP
Manufacturer
Freescale Semiconductor
Series
MCF521xr
Datasheet

Specifications of MCF5212CAE66

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
66MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
55
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
MCF521x
Core
ColdFire V2
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
I2C, QSPI, UART
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
56
Number Of Timers
10
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
M52210DEMO, M52211EVB
Minimum Operating Temperature
0 C
On-chip Adc
12 bit, 8 Channel
For Use With
M5211DEMO - KIT DEMO FOR MCF5211
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Price
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Electrical Characteristics
2.3
Table 23
28
1
2
3
1 MHz core & I/O
8 MHz core & I/O
16 MHz core & I/O
64 MHz core & I/O
80 MHz core & I/O
RAM standby supply current
Analog supply current
• Normal operation
• Low-power stop
100 LQFP
Tested at room temperature with CPU polling a status register. All clocks were off except the UART and CFM (when
running from flash memory).
Peak current measured with all modules active, and default drive strength with matching load.
Due to the errata “Non-functional RAM Standby Supply” in the MCF5213 Device Errata, V
directly to V
Transient condition: V
Normal operation: V
Standby operation: V
lists thermal resistance values.
Thermal Characteristics
DD
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient, (@200 ft/min)
Junction to ambient, (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
and cannot be used for RAM standby operation.
Characteristic
Table 22. Typical Active Current Consumption Specifications
DD
DD
STBY
> V
< V
- 0.3 V > V
STBY
SS
+ 0.5 V
- 0.3 V
MCF5213 ColdFire Microcontroller, Rev. 4
Table 23. Thermal Characteristics
DD
Characteristic
> V
SS
+ 0.5 V
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
Symbol
I
I
STBY
I
DDA
DD
Typical
(SRAM)
Active
12.08
40.14
7.28
49.2
1
N/A
N/A
N/A
3
3
3
Symbol
Typical
(Flash)
Active
θ
θ
13.37
25.08
54.62
64.09
θ
θ
θ
θ
3.48
Ψ
JMA
JMA
T
JA
JA
JB
JC
STBY
jt
j
1
should be connected
Freescale Semiconductor
Value
100.03
53
39
42
33
Peak
19.02
35.66
85.01
105
25
N/A
N/A
N/A
9
2
16
50
1,2
1,3
1,3
1,3
5
6
4
3
3
3
2
Unit
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
°C / W
Unit
mA
mA
mA
μA
μA
μA
o
C

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