MCF52233CAL60 Freescale Semiconductor, MCF52233CAL60 Datasheet - Page 47

• Manufacturer Part Number: MCF52233CAL60
• Description: IC MCU 256K FLASH 60MHZ 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCF5223xr

Specifications of MCF52233CAL60

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 60MHz
• Connectivity: Ethernet, I²C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 73
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• Cpu Family: MCF5223x
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 60MHz
• Interface Type: I2C/QSPI/UART
• Total Internal Ram Size: 32KB
• # I/os (max): 56
• Number Of Timers - General Purpose: 10
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 8-chx12-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 112
• Package Type: LQFP
• Processor Series: MCF522x
• Core: ColdFire V2
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 56
• Number Of Timers: 10
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: M52235EVB, M52233DEMO
• Minimum Operating Temperature: - 40 C
• Package: 112LQFP
• Family Name: MCF5223x
• Maximum Speed: 60 MHz
• Operating Supply Voltage: 3.3 V
• For Use With: M52233DEMO - BOARD DEMO FOR MCF52233
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

3
This section describes the physical properties of the MCF52235 and its derivatives.
3.1
Freescale Semiconductor
Mechanical Outline Drawings
80-pin LQFP Package
SEATING
PLANE
–H–
–T–
–L–
0.05 (0.002)
20
1
4X
C
80
21
3X
0.20 (0.008) H
VIEW Y
S1
C2
A1
S
C1
(W)
VIEW AA
MCF52235 ColdFire Microcontroller Data Sheet, Rev. 10
A
S
L–M
N
–N–
(Z)
8X
(K)
E
2
1
2X R
40
61
R1
4X 20 TIPS
60
41
–M–
0.20 (0.008) T
B1
VIEW AA
CASE 917A–02
0.25 (0.010)
V1
ISSUE C
0.10 (0.004) T
GAGE
PLANE
B
V
L–M
N
NOTES:
C L
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
Y14.5M, 1982.
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
AT DATUM PLANE –H–.
SEATING PLANE –T–.
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.460
(0.018). MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
DIM
A1
B1
C1
C2
R1
S1
V1
01
02
W
A
B
C
D
E
F
G
J
K
P
S
U
V
Z
0
0.13 (0.005)
AB
AB
ROTATED 90 CLOCKWISE
MILLIMETERS
MIN
0.04
1.30
0.22
0.40
0.17
0.09
0.10
0.09
–––
J
0.325 BSC
16.00 BSC
14.00 BSC
14.00 BSC
16.00 BSC
SECTION AB–AB
7.00 BSC
7.00 BSC
0.65 BSC
8.00 BSC
0.50 REF
8.00 BSC
0.20 REF
1.00 REF
0
0
9
Í Í Í Í
Ç Ç Ç
Í Í Í Í
Ç Ç Ç
PLATING
MAX
1.60
0.24
1.50
0.38
0.75
0.33
0.27
0.20
0.16
10
–––
14
VIEW Y
M
F
D
Mechanical Outline Drawings
0.002
0.051
0.009
0.016
0.007
0.004
0.004
0.004
MIN
T
–––
0.551 BSC
0.276 BSC
0.551 BSC
0.276 BSC
0.026 BSC
0.020 REF
0.013 REF
0.630 BSC
0.315 BSC
0.630 BSC
0.315 BSC
0.039 REF
0.008 REF
0
0
9
INCHES
L–M
DATE 09/21/95
G
U
MAX
0.063
0.009
0.059
0.015
0.030
0.013
0.011
0.008
0.006
10
–––
14
S
–X–
X= L, M, N
METAL
BASE
N
S
P
47