MCF52233CAL60 Freescale Semiconductor, MCF52233CAL60 Datasheet - Page 30
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MCF52233CAL60
Manufacturer Part Number
MCF52233CAL60
Description
IC MCU 256K FLASH 60MHZ 112-LQFP
Manufacturer
Freescale Semiconductor
Series
MCF5223xr
Datasheet
1.MCF52236AF50.pdf
(55 pages)
Specifications of MCF52233CAL60
Core Processor
Coldfire V2
Core Size
32-Bit
Speed
60MHz
Connectivity
Ethernet, I²C, SPI, UART/USART
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
73
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
112-LQFP
Cpu Family
MCF5223x
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
60MHz
Interface Type
I2C/QSPI/UART
Total Internal Ram Size
32KB
# I/os (max)
56
Number Of Timers - General Purpose
10
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx12-bit
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
112
Package Type
LQFP
Processor Series
MCF522x
Core
ColdFire V2
Data Bus Width
32 bit
Data Ram Size
32 KB
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
56
Number Of Timers
10
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
M52235EVB, M52233DEMO
Minimum Operating Temperature
- 40 C
Package
112LQFP
Family Name
MCF5223x
Maximum Speed
60 MHz
Operating Supply Voltage
3.3 V
For Use With
M52233DEMO - BOARD DEMO FOR MCF52233
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCF52233CAL60
Manufacturer:
FREESCAL
Quantity:
1 000
Company:
Part Number:
MCF52233CAL60
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Electrical Characteristics
30
1
2
3
4
5
6
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package, natural convection
Maximum operating junction temperature
The use of this device in one- or two-layer board designs is not recommended due to the limited thermal conductance
provided by those boards.
recommends the use of
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the
dissipation, and the method described in EIA/JESD Standard 51-2.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
JMA
and
jt
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
Characteristic
JMA
MCF52235 ColdFire Microcontroller Data Sheet, Rev. 10
and power dissipation specifications in the system design to prevent device junction
Table 20. Thermal Characteristics
Symbol
JMA
T
JA
JB
JC
jt
j
80-pin LQFP, four-layer board
112-pin LQFP, four-layer board
121 MAPBGA, four-layer board
80-pin LQFP, one-layer board
121 MAPBGA, one-layer board
112-pin LQFP, one-layer board
80-pin LQFP, four-layer board
112-pin LQFP, four-layer board
121 MAPBGA, four-layer board
80-pin LQFP, one-layer board
112-pin LQFP, one-layer board
121 MAPBGA, one-layer board
80-pin LQFP
112-pin LQFP
121 MAPBGA, four-layer board
80-pin LQFP
112-pin LQFP
121 MAPBGA
80-pin LQFP
112-pin LQFP
121 MAPBGA
All
Package
1
1
1
1
1
1
1
jt
parameter, the device power
Freescale Semiconductor
36.0
Value
49.0
44.0
39.0
35.0
22.0
35.0
30.0
29.0
23.0
6.0
2.0
2.0
2.0
130
56
46
6.0
10
32
28
18
2,3
1
1
5
6
6
6
1
1
1
1
4
C / W
C / W
C / W
C / W
C / W
Unit
o
C