R5F363AENFA#U0 Renesas Electronics America, R5F363AENFA#U0 Datasheet - Page 100

MCU 4KB FLASH 256/16K 100-QFP

R5F363AENFA#U0

Manufacturer Part Number
R5F363AENFA#U0
Description
MCU 4KB FLASH 256/16K 100-QFP
Manufacturer
Renesas Electronics America
Series
M16C/60/63r
Datasheets

Specifications of R5F363AENFA#U0

Core Processor
M16C/60
Core Size
16/32-Bit
Speed
20MHz
Connectivity
EBI/EMI, I²C, SIO, UART/USART
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 26x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 85°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
R5F363AENFA#U0
Manufacturer:
Renesas Electronics America
Quantity:
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Company:
Part Number:
R5F363AENFA#U0
Manufacturer:
Renesas Electronics America
Quantity:
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M16C/63 Group
REJ03B0271-0100 Rev.1.00 Sep 15, 2009
Page 98 of 113
Switching Characteristics
(V
Table 5.58
Notes:
CC1
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
d(BCLK-AD)
h(BCLK-AD)
h(RD-AD)
h(WR-AD)
d(BCLK-CS)
h(BCLK-CS)
h(RD-CS)
h(WR-CS)
d(BCLK-RD)
h(BCLK-RD)
d(BCLK-WR)
h(BCLK-WR)
d(BCLK-DB)
h(BCLK-DB)
d(DB-WR)
h(WR-DB)
d(BCLK-HLDA)
d(BCLK-ALE)
h(BCLK-ALE)
d(AD-ALE)
h(AD-ALE)
d(AD-RD)
d(AD-WR)
dz(RD-AD)
5.3.4.3
1.
2.
3.
4.
5.
= V
Symbol
Calculated according to the BCLK frequency as follows:
Calculated according to the BCLK frequency as follows:
Calculated according to the BCLK frequency as follows:
Calculated according to the BCLK frequency as follows:
When using multiplexed bus, set f
0.5 10
--------------------- - 10 ns
(
----------------------------------- - 50 ns
0.5 10
--------------------- - 40 ns
0.5 10
--------------------- - 15 ns
CC2
f
f
f
n 0.5
(
(
(
BCLK
BCLK
BCLK
f
×
×
×
(
BCLK
= 3 V, V
)
)
)
) 10
9
9
9
In 2 or 3 Waits Setting, and When Accessing External Area and Using
Multiplexed Bus
Memory Expansion Mode and Microprocessor Mode (in 2 or 3 Waits Setting, and When
Accessing External Area and Using Multiplexed Bus)
×
Address output delay time
Address output hold time (in relation to BCLK)
Address output hold time (in relation to RD)
Address output hold time (in relation to WR)
Chip select output delay time
Chip select output hold time (in relation to BCLK)
Chip select output hold time (in relation to RD)
Chip select output hold time (in relation to WR)
RD signal output delay time
RD signal output hold time
WR signal output delay time
WR signal output hold time
Data output delay time (in relation to BCLK)
Data output hold time (in relation to BCLK)
Data output delay time (in relation to WR)
Data output hold time (in relation to WR)
HLDA
ALE signal output delay time (in relation to BCLK)
ALE signal output hold time (in relation to BCLK)
ALE signal output delay time (in relation to Address)
ALE signal output hold time (in relation to Address)
RD signal output delay from the end of address
WR signal output delay from the end of address
Address output floating start time
)
9
[
[
[
SS
output delay time
]
]
]
= 0 V, at T
[
]
n is 2 for 2 waits setting, 3 for 3 waits setting.
opr
(BCLK)
= -20 to 85 ° C/-40 to 85 ° C unless otherwise specified)
Parameter
12.5 MHz or less.
Figure 5.28
Measuring
Condition
See
(5)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 2)
(Note 1)
(Note 3)
(Note 4)
Min.
5. Electrical Characteristics
− 4
0
0
0
0
0
0
0
Standard
V
CC1
Max.
= V
50
50
40
40
50
40
25
8
CC2
= 3 V
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns

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