MCF5274LVM166J Freescale Semiconductor, MCF5274LVM166J Datasheet - Page 43
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MCF5274LVM166J
Manufacturer Part Number
MCF5274LVM166J
Description
IC MCU 166MHZ 196MAPBGA
Manufacturer
Freescale Semiconductor
Series
MCF527xr
Datasheet
1.MCF5274LVM166J.pdf
(44 pages)
Specifications of MCF5274LVM166J
Core Processor
Coldfire V2
Core Size
32-Bit
Speed
166MHz
Connectivity
EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals
DMA, WDT
Number Of I /o
61
Program Memory Type
ROMless
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
196-MAPBGA
Processor Series
MCF527x
Core
ColdFire V2
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
NNDK-MOD5272-KIT, NNDK-MOD5270-KIT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCF5274LVM166J
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
9
Documentation regarding the MCF5275 and their development support tools is available from a local
Freescale distributor, a Freescale semiconductor sales office, the Freescale Literature Distribution Center,
or through the Freescale web address at http://www.freescale.com/coldfire.
10
Table 29
Freescale Semiconductor
Rev. No.
1.1
1.2
1.3
0
1
2
3
4
provides a revision history for this hardware specification.
Documentation
Revision History
Initial release.
Added
Removed duplicate information in the module description sections. The information is all in the Signals
Removed Overview, Features, Signal Descriptions, Modes of Operation, and Address Multiplexing sections. This
Removed list of documentation in
Changed CLKOUT -> PSTCLK in
Table
Table
Added
Added thermal characteristics for 196 MAPBGA in
Updated package dimensions drawing,
Removed second sentence from
Removed third and fourth paragraphs from
Corrected Ordering Information,
Figure
Table
Table
Description Table.
information can be found in the MCF5275 Reference Manual.
site.
B6a, B6b, B6c maximum changed from “0.5t
B7, B7a minimum changed from “0.5t
B9, B11 minimum changed from “1.5” to “1.0”
FECn_RXER, and
FECn_TXEN, FECn_TXER,
FECn_TXEN, FECn_TXER,
10: Update V
13: Timings B6a, B6b, B6c, B7, B7a, B9, B12 updated:
10: Corrected maximum “Input High Voltage 3.3V I/O Pads”, V
10, added PLL supply voltage row
2: Moved PLLV
Figure
Section 5.2.1, “Supply Voltage Sequencing and Separation
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 4
6.
DD
FECn_RXCLK),”
DD
spec from 1.35-1.65 to 1.4-1.6.
from 1.5V to 3.3V supply line and corrected relevant text in sections below table.
Table 29. Document Revision History
FECn_TXCLK),”
FECn_TXCLK),”
Table
Section 8.11.1, “MII Receive Signal Timing (FECn_RXD[3:0], FECn_RXDV,
Section 9,
Section 8.16, “Debug AC Timing
6.
and
Figure
CYC
Substantive Change(s)
Section 8.11.2, “MII Transmit Signal Timing (FECn_TXD[3:0],
Section 8.11.2, “MII Transmit Signal Timing (FECn_TXD[3:0],
“Documentation.”. An up-to-date list is always available on our web
+ 1.5” to “0.5t
6.
CYC
regarding no minimum frequency requirement for TXCLK.
as this feature is not supported on this device.
Table
+ 5” to “0.5t
8.
CYC
+ 1.0”
CYC
Cautions.”
Specifications.”
+ 5.5”
IH
specification.
Documentation
43