MCF5274LVM166J Freescale Semiconductor, MCF5274LVM166J Datasheet - Page 17

• Manufacturer Part Number: MCF5274LVM166J
• Description: IC MCU 166MHZ 196MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF527xr

Specifications of MCF5274LVM166J

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 166MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
• Peripherals: DMA, WDT
• Number Of I /o: 61
• Program Memory Type: ROMless
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 196-MAPBGA
• Processor Series: MCF527x
• Core: ColdFire V2
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: NNDK-MOD5272-KIT, NNDK-MOD5270-KIT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

6.4
Figure 6
Freescale Semiconductor
196X
13X
3
e
X
E
Y
b
0.15
0.08 Z
shows MCF5275 196 MAPBGA package dimensions.
S
Package Dimensions - 196 MAPBGA
TOL
Z
14 13 12 11
X
Y
Laser mark for pin 1
identification in
this area
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 4
10 9
View M-M
D
Figure 6. 196 MAPBGA Package Dimensions
6
13X
S
5 4
e
3 2
1
M
C
D
G
H
N
A
B
E
F
J
K
L
P
Metalized mark for
pin 1 identification
in this area
K
M
M
A
A2
A1
Rotated 90° Clockwise
NOTES:
1.
2.
3.
4.
5.
Z
Dimensions are in millimeters.
Interpret dimensions and tolerances
per ASME Y14.5M, 1994.
Dimension b is measured at the
maximum solder ball diameter,
parallel to datum plane Z.
Datum Z (seating plane) is defined
by the spherical crowns of the solder
balls.
Parallelism measurement shall
exclude any effect of mark on top
surface of package.
DIM
A1
A2
Detail K
A
D
b
E
e
S
4
Min
1.25
0.27
0.45
Millimeters
15.00 BSC
15.00 BSC
1.00 BSC
0.50 BSC
1.16 REF
196X
Mechanicals/Pinouts
0.10 Z
Max
1.60
0.47
0.55
5
0.20 Z
17