MC9S12XEQ512CAL Freescale Semiconductor, MC9S12XEQ512CAL Datasheet - Page 349

• Manufacturer Part Number: MC9S12XEQ512CAL
• Description: MCU 16BIT 512K FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XEQ512CAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• No. Of I/o's: 91
• Eeprom Memory Size: 4KB
• Ram Memory Size: 32KB
• Cpu Speed: 50MHz
• No. Of Timers: 3
• No. Of Pwm Channels: 8
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• Processor Series: S12XE
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN, SCI, SPI
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 25
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 9
Security (S12XE9SECV2)
9.1
This specification describes the function of the security mechanism in the S12XE chip family (9SEC).
9.1.1
The user must be reminded that part of the security must lie with the application code. An extreme example
would be application code that dumps the contents of the internal memory. This would defeat the purpose
of security. At the same time, the user may also wish to put a backdoor in the application program. An
example of this is the user downloads a security key through the SCI, which allows access to a
programming routine that updates parameters stored in another section of the Flash memory.
The security features of the S12XE chip family (in secure mode) are:
Freescale Semiconductor
Revision
Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers
Number
V02.00
V02.01
V02.02
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
•
•
•
•
•
Protect the content of non-volatile memories (Flash, EEPROM)
Execution of NVM commands is restricted
Disable access to internal memory via background debug module (BDM)
Disable access to internal Flash/EEPROM in expanded modes
Disable debugging features for the CPU and XGATE
Introduction
Revision Date
Features
27 Aug 2004
21 Feb 2007
19 Apr 2007
No security feature is absolutely secure. However, Freescale’s strategy is to
make reading or copying the FLASH and/or EEPROM difficult for
unauthorized users.
Sections
Affected
MC9S12XE-Family Reference Manual , Rev. 1.23
Table 9-1. Revision History
- Reviewed and updated for S12XD architecture
- Added S12XE, S12XF and S12XS architectures
- Corrected statement about Backdoor key access via BDM on XE, XF, XS
NOTE
Description of Changes
349