MCF52223CAF80 Freescale Semiconductor, MCF52223CAF80 Datasheet - Page 30

• Manufacturer Part Number: MCF52223CAF80
• Description: IC MCU 256K FLASH 80MHZ 100-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCF5222xr

Specifications of MCF52223CAF80

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: I²C, SPI, UART/USART, USB OTG
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 56
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: MCF522x
• Core: ColdFire V2
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: I2C/QSPI/UART/USB
• Maximum Clock Frequency: 80 MHz
• Number Of Programmable I/os: 56
• Number Of Timers: 10
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: M52221DEMO, M52223EVB
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 12-bit
• For Use With: M52223EVB - BOARD EVAL FOR MCF52223
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

2.3
Table 24
Freescale Semiconductor
1
2
3
4
5
81 MAPBGA Junction to ambient, natural convection

recommends the use of 
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the 
dissipation, and the method described in EIA/JESD Standard 51-2.
Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board JESD51-7) horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
100 LQFP
64 LQFP
JA
and 
lists thermal resistance values.
Thermal Characteristics
jt
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient, (@200 ft/min)
Junction to ambient, (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
Junction to ambient, natural convection
Junction to ambient, (@200 ft/min)
Junction to ambient, (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
Junction to ambient, natural convection
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
JA
and power dissipation specifications in the system design to prevent device junction
MCF52223 ColdFire Microcontroller, Rev. 3
Table 24. Thermal Characteristics
Characteristic
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
—
—
—
—
—
—
—
—
—
Symbol





















JMA
JMA
JMA
JMA
JMA
JMA
T
T
T
JA
JA
JB
JC
JA
JA
JB
JC
JA
JA
JB
JC
jt
jt
j
jt
j
jt
j
parameter, the device power
Electrical Characteristics
Value
53
39
42
33
61
35
50
31
62
43
50
36
105
105
105
25
20
12
26
9
2
2
9
2
1,2
1,3
1,3
1,3
5
6
1,2
2,3
2,3
2,3
6
1,2
1,3
1,3
1,3
5
6
4
4
5
4
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
C / W
Unit
o
o
o
C
C
C
30