MCF51EM256CLL Freescale Semiconductor, MCF51EM256CLL Datasheet - Page 18

IC MCU 32BIT 256KB FLASH 100LQFP

MCF51EM256CLL

Manufacturer Part Number
MCF51EM256CLL
Description
IC MCU 32BIT 256KB FLASH 100LQFP
Manufacturer
Freescale Semiconductor
Series
MCF51EMr
Datasheets

Specifications of MCF51EM256CLL

Core Processor
Coldfire V1
Core Size
32-Bit
Speed
50MHz
Connectivity
I²C, SCI, SPI
Peripherals
LCD, LVD, PWM, WDT
Number Of I /o
63
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
MCF51EM
Core
ColdFire V1
Data Bus Width
32 bit
Data Ram Size
16 KB
Interface Type
RS-232, LIN
Maximum Clock Frequency
50 MHz
Number Of Timers
3
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
DEMOEM
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF51EM256CLL
Manufacturer:
FREESCALE
Quantity:
110
Part Number:
MCF51EM256CLL
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Electrical Characteristics
2.3
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and it is user-determined rather than being controlled by the MCU design. In order to take
P
V
loads), the difference between pin voltage and V
The average chip-junction temperature (T
18
I/O
DD
into account in power calculations, determine the difference between actual pin voltage and V
and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy
Thermal Characteristics
3
4
5
6
1
2
3
4
Operating temperature range (packaged)
Maximum junction temperature
Thermal resistance
100-pin LQFP
80-pin LQFP
Power supply must maintain regulation within operating V
operating maximum current conditions. If positive injection current (V
I
out of regulation. Ensure external V
current. This will be the greatest risk when the MCU is not consuming power. Examples are: if
no system clock is present, or if the clock rate is very low which would reduce overall power
consumption.
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive (V
voltages, then use the larger of the two resistance values.
All functional non-supply pins are internally clamped to V
Power supply must maintain regulation within operating V
operating maximum current conditions. If positive injection current (V
I
out of regulation. Ensure external V
current. This will be the greatest risk when the MCU is not consuming power. Examples are: if
no system clock is present, or if the clock rate is very low which would reduce overall power
consumption.
Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation
of other components on the board, and board thermal resistance.
Junction to Ambient Natural Convection
1s — Single layer board, one signal layer
2s2p — Four layers board, two signal and two power layers
DD
DD
, the injection current may flow out of V
, the injection current may flow out of V
MCF51EM256 Series ColdFire Microcontroller Data Sheet, Rev.3
1,2,3,4
Preliminary—Subject to Change Without Notice
Rating
Table 7. Thermal Characteristics
J
) in °C can be obtained from:
DD
DD
load will shunt current greater than maximum injection
load will shunt current greater than maximum injection
SS
DD
DD
or V
and could result in external power supply going
and could result in external power supply going
2s2p
2s2p
DD
1s
1s
will be very small.
SS
DD
DD
Symbol
and V
T
range during instantaneous and
range during instantaneous and
θ
T
JM
JA
A
DD
DD
) and negative (V
.
In
In
> V
> V
–40 to 85
Value
DD
DD
95
54
42
55
42
) is greater than
) is greater than
Freescale Semiconductor
SS
) clamp
°C/W
Unit
°C
°C
SS
or

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