MC9S08AW32CFGE Freescale Semiconductor, MC9S08AW32CFGE Datasheet - Page 295

• Manufacturer Part Number: MC9S08AW32CFGE
• Description: IC MCU 32K FLASH 44-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08AW32CFGE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 34
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-LQFP
• Processor Series: S08AW
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 34
• Number Of Timers: 8
• Operating Supply Voltage: - 0.3 V to + 5.8 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08AW60E
• Minimum Operating Temperature: - 55 C
• On-chip Adc: 10 bit, 8 Channel
• Package: 44LQFP
• Family Name: HCS08
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

V
loads), the difference between pin voltage and V
The average chip-junction temperature (T
where:
For most applications, P
(if P
Solving equations 1 and 2 for K gives:
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring
P
solving equations 1 and 2 iteratively for any value of T
Freescale Semiconductor
D
DD
(at equilibrium) for a known T
I/O
and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy
is neglected) is:
T
θ
P
P
P
JA
A
D
int
I/O
1
2
3
4
= Ambient temperature, °C
Operating temperature range (packaged)
Thermal resistance
= P
= Package thermal resistance, junction-to-ambient, °C/W
= I
= Power dissipation on input and output pins — user determined
Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power
dissipation of other components on the board, and board thermal resistance.
Junction to Ambient Natural Convection
1s - Single Layer Board, one signal layer
2s2p - Four Layer Board, 2 signal and 2 power layers
int
DD
48-pin QFN
44-pin LQFP
32-pin LQFP
42-pin SDIP
+ P
× V
I/O
I/O
DD
<< P
, Watts — chip internal power
1,2,3,4
K = P
int
Rating
A
and can be neglected. An approximate relationship between P
MC9S08AC16 Series Data Sheet, Rev. 8
. Using this value of K, the values of P
Table A-3. Thermal Characteristics
D
P
T
× (T
D
J
= K ÷ (T
= T
J
A
) in °C can be obtained from:
+ 273°C) + θ
A
+ (P
SS
J
D
+ 273°C)
or V
× θ
Appendix A Electrical Characteristics and Timing Specifications
2s2p
2s2p
2s2p
2s2p
A
JA
DD
JA
.
1s
1s
1s
1s
)
× (P
will be very small.
Symbol
D
θ
T
)
JA
A
2
–40 to 125
T
Value
D
L
84
27
73
56
85
56
58
47
to T
and T
H
J
can be obtained by
°C/W
Unit
°C
D
Eqn. A-1
Eqn. A-2
Eqn. A-3
and T
295
J