MC9S08DZ48AMLF Freescale Semiconductor, MC9S08DZ48AMLF Datasheet - Page 18
![MCU 8BIT 48K FLASH EE 48-LQFP](/photos/37/62/376254/lqfp-48_sml.jpg)
MC9S08DZ48AMLF
Manufacturer Part Number
MC9S08DZ48AMLF
Description
MCU 8BIT 48K FLASH EE 48-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheets
1.DEMO9S08DZ60.pdf
(416 pages)
2.EVB9S08DZ60.pdf
(4 pages)
3.MC9S08DZ48AMLF.pdf
(458 pages)
Specifications of MC9S08DZ48AMLF
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
48KB (48K x 8)
Program Memory Type
FLASH
Eeprom Size
1.5K x 8
Ram Size
3K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
48-LQFP
Processor Series
S08DZ
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
3 KB
Interface Type
CAN, I2C, SCI, SPI
Number Of Programmable I/os
40
Number Of Timers
2
Operating Supply Voltage
5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08DZ60
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08DZ48AMLF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Section Number
17.1 Introduction ....................................................................................................................................379
17.2 Background Debug Controller (BDC) ...........................................................................................380
17.3 Register Definition .........................................................................................................................387
18.1 Introduction ....................................................................................................................................393
18.2 Signal Description ..........................................................................................................................394
18.3 Memory Map and Registers ...........................................................................................................395
18.4 Functional Description ...................................................................................................................410
18.5 Resets .............................................................................................................................................416
18.6 Interrupts ........................................................................................................................................417
18.7 Electrical Specifications .................................................................................................................417
A.1 Introduction ...................................................................................................................................419
A.2 Parameter Classification ................................................................................................................419
A.3 Absolute Maximum Ratings ..........................................................................................................419
A.4 Thermal Characteristics .................................................................................................................420
18
17.1.1 Forcing Active Background ............................................................................................379
17.1.2 Features ...........................................................................................................................380
17.2.1 BKGD Pin Description ...................................................................................................381
17.2.2 Communication Details ..................................................................................................381
17.2.3 BDC Commands .............................................................................................................385
17.2.4 BDC Hardware Breakpoint .............................................................................................387
17.3.1 BDC Registers and Control Bits .....................................................................................388
17.3.2 System Background Debug Force Reset Register (SBDFR) ..........................................390
18.1.1 Features ...........................................................................................................................393
18.1.2 Modes of Operation ........................................................................................................394
18.1.3 Block Diagram ................................................................................................................394
18.3.1 Module Memory Map .....................................................................................................395
18.3.2
18.3.3 Register Descriptions ......................................................................................................397
18.4.1 Comparator .....................................................................................................................410
18.4.2 Breakpoints .....................................................................................................................411
18.4.3 Trigger Selection .............................................................................................................411
18.4.4 Trigger Break Control (TBC) .........................................................................................412
18.4.5 FIFO ................................................................................................................................415
18.4.6 Interrupt Priority .............................................................................................................416
Debug Module (S08DBGV3) (128K)
MC9S08DZ128 Series Data Sheet, Rev. 1
Electrical Characteristics
Development Support
Appendix A
Chapter 17
Chapter 18
Title
Freescale Semiconductor
Page
396
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