S9S08DZ32F1MLH Freescale Semiconductor, S9S08DZ32F1MLH Datasheet - Page 40

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S9S08DZ32F1MLH

Manufacturer Part Number
S9S08DZ32F1MLH
Description
MCU 32K FLASH MASK AUTO 64-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of S9S08DZ32F1MLH

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 24x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
64-LQFP
Processor Series
S08D
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SCI, SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
53
Number Of Timers
8
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08DZ60
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 24 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
S9S08DZ32F1MLH
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Chapter 3 Modes of Operation
40
5
6
7
ERCLKEN and EREFSTEN set in MCGC2 for, else in standby. For high frequency
range (RANGE in MCGC2 set) requires the LVD to also be enabled in stop3.
If ENBDM is set when entering stop2, the MCU will actually enter stop3.
If LVDSE is set when entering stop2, the MCU will actually enter stop3.
MC9S08DZ60 Series Data Sheet, Rev. 4
Freescale Semiconductor

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