S9S08DZ32F1MLH Freescale Semiconductor, S9S08DZ32F1MLH Datasheet - Page 369

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S9S08DZ32F1MLH

Manufacturer Part Number
S9S08DZ32F1MLH
Description
MCU 32K FLASH MASK AUTO 64-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of S9S08DZ32F1MLH

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 24x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
64-LQFP
Processor Series
S08D
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SCI, SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
53
Number Of Timers
8
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08DZ60
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 24 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
S9S08DZ32F1MLH
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Appendix A
Electrical Characteristics
A.1
This section contains the most accurate electrical and timing information for the MC9S08DZ60 Series of
microcontrollers available at the time of publication.
A.2
The electrical parameters shown in this supplement are guaranteed by various methods. To give the
customer a better understanding the following classification is used and the parameters are tagged
accordingly in the tables where appropriate:
A.3
Absolute maximum ratings are stress ratings only, and functional operation at the maxima is not
guaranteed. Stress beyond the limits specified in
permanent damage to the device. For functional operating conditions, refer to the remaining tables in this
section.
Freescale Semiconductor
C
D
P
T
Introduction
Parameter Classification
Absolute Maximum Ratings
Those parameters are guaranteed during production testing on each individual device.
Those parameters are achieved by the design characterization by measuring a
statistically relevant sample size across process variations.
Those parameters are achieved by design characterization on a small sample size from
typical devices under typical conditions unless otherwise noted. All values shown in
the typical column are within this category.
Those parameters are derived mainly from simulations.
The classification is shown in the column labeled “C” in the parameter
tables where appropriate.
Table A-1. Parameter Classifications
MC9S08DZ60 Series Data Sheet, Rev. 4
Table A-2
NOTE
may affect device reliability or cause
369

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