MC9S08SH16CTL Freescale Semiconductor, MC9S08SH16CTL Datasheet - Page 315

• Manufacturer Part Number: MC9S08SH16CTL
• Description: MCU 8BIT 16K FLASH 28-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08SH16CTL

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 23
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-TSSOP
• Processor Series: S08SH
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 23
• Number Of Timers: 2
• Operating Supply Voltage: 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08SG32, DEMO9S08SG32AUTO, DEMO9S08SG8, DEMO9S08SG8AUTO, DEMO9S08SH32, DEMO9S08SH8
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 12 Channel
• Package: 28TSSOP
• Family Name: HCS08
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Appendix B
Ordering Information and Mechanical Drawings
B.1
This section contains ordering information for MC9S08SH32 and MC9S08SH16 devices.
B.1.1
This device uses a smart numbering system. Refer to the following diagram to understand what each
element of the device number represents.
Freescale Semiconductor
Jennifer
1
2
See
See
Device Number
MC9S08SH32
MC9S08SH16
Core
Family
- SH
Status
- MC = Fully Qualified
Main Memory Type
- 9 = Flash-based
Table
Table B-2
Ordering Information
Device Numbering Scheme
1-1for a complete description of modules included on each device.
for package information.
1
Figure B-1. MC9S08SH32 Device Numbering Scheme
Flash
32 K
16
MC 9
Table B-1. Device Numbering System
Memory
MC9S08SH32 Series Data Sheet, Rev. 2
S08 SH n
1024 B
1024 B
RAM
Memory Size
- 32 Kbytes
- 16 Kbytes
PRELIMINARY
28 TSSOP
28 SOIC
C
28-Pin
xx
R
Available Packages
20 TSSOP
20-Pin
Tape and Reel Suffix (optiona
- R = Tape and Reel
Package Designator
Two letter descriptor (refer to
Table
Temperature Option
- C = –40 to 85 °C
- M = –40 to 125 °C
B-2).
2
16 TSSOP
16-Pin
315