MC9S08MP16VLF Freescale Semiconductor, MC9S08MP16VLF Datasheet - Page 35

• Manufacturer Part Number: MC9S08MP16VLF
• Description: MCU 8BIT .25U SGF FLASH 48-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08MP16VLF

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 51.34MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 40
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 13x12b, D/A 3x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 48-LQFP
• Processor Series: S08MP
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: SCI
• Maximum Clock Frequency: 51.34 MHz
• Number Of Programmable I/os: 40
• Number Of Timers: 2
• Operating Supply Voltage: - 0.3 V to + 5.8 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08MP16
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 13 Channel
• On-chip Dac: 3 DAC, 5 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

3.1
Example of the device numbering system:
4
The latest package outline drawings are available on the product summary pages on our web site:
http://www.freescale.com/8bit. The following table lists the document numbers per package. Use these numbers in the web
page’s keyword search engine to find the latest package outline drawings.
5
Find the most current versions of all documents at http://www.freescale.com.
6
To provide the most up-to-date information, the revision of our documents on the World Wide Web are the most current. Your
printed copy may be an earlier revision. To verify you have the latest information available, refer to:
Freescale Semiconductor
Pin Count
48
32
28
http://www.freescale.com
Reference Manual
Device Numbering Scheme
Package Information
Related Documentation
Revision History
Status
Memory
MC = Consumer &
S = Automotive Qualified
9 = Flash-based
Industrial
The 32 LQFP and 28 SOIC are not qualified to meet automotive requirements.
Small Outline Integrated Circuit
Family
Core
Low Quad Flat Pack
Low Quad Flat Pack
Package Type
(MC9S08MP16RM)
xx
Contains extensive product information including modes of operation, memory,
resets and interrupts, register definition, port pins, CPU, and all module
information.
9 S08
MC9S08MP16 Series Data Sheet, Rev. 1
Table 23. Package Descriptions
MP
nn
E2
Abbreviation
y
LQFP
LQFP
SOIC
NOTE
zz
Package designator (see
Temperature range
Wafer fab site and mask revision
Flash size
V = –40°C to 105°C
M = –40°C to 125°C
(this field appears only in automotive-qualified
16 KBytes
12 KBytes
Designator
part numbers)
WL
LC
LF
Case No.
873A-03
751F-05
932-03
Table
23)
Package Information
Document No.
98ASH00962A
98ASH70029A
98ASB42345B
35