F272-BAGE-T-TR STMicroelectronics, F272-BAGE-T-TR Datasheet - Page 100

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F272-BAGE-T-TR

Manufacturer Part Number
F272-BAGE-T-TR
Description
MCU 16BIT 256K FLASH 144-TQFP
Manufacturer
STMicroelectronics
Series
ST10r
Datasheet

Specifications of F272-BAGE-T-TR

Core Processor
ST10
Core Size
16-Bit
Speed
40MHz
Connectivity
ASC, CAN, EBI/EMI, I²C, SSC, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
111
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
144-TQFP, 144-VQFP
Data Bus Width
16 bit
Data Ram Size
20 KB
Interface Type
ASC, CAN, I2C, SSC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
111
Number Of Timers
4
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 24 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
No

Available stocks

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Part Number
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Quantity
Price
Part Number:
F272-BAGE-T-TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
System reset
100/182
To ensure correct power-up reset with controlled supply current consumption, specially if
clock signal requires a long period of time to stabilize, an asynchronous hardware reset is
required during power-up. For this reason, it is recommended to connect the external R0-C0
circuit shown in Figure 30 to the RPD pin. On power-up, the logical low level on RPD pin
forces an asynchronous hardware reset when RSTIN is asserted low. The external pull-up
R0 will then charge the capacitor C0. Note that an internal pull-down device on RPD pin is
turned on when RSTIN pin is low, and causes the external capacitor (C0) to begin
discharging at a typical rate of 100-200µA. With this mechanism, after power-up reset, short
low pulses applied on RSTIN produce synchronous hardware reset. If RSTIN is asserted
longer than the time needed for C0 to be discharged by the internal pull-down device, then
the device is forced in an asynchronous reset. This mechanism insures recovery from very
catastrophic failure.
Figure 30. Minimum external reset circuitry
The minimum reset circuit of
the ST10F272 itself during software or watchdog triggered resets, because of the capacitor
C1 that will keep the voltage on RSTIN pin above V
sequence, and thus will trigger an asynchronous reset sequence.
Figure 31 shows an example of a reset circuit. In this example, R1-C1 external circuit is only
used to generate power-up or manual reset, and R0-C0 circuit on RPD is used for power-up
reset and to exit from Power Down mode. Diode D1 creates a wired-OR gate connection to
the reset pin and may be replaced by open-collector Schmitt trigger buffer. Diode D2
provides a faster cycle time for repetitive power-on resets.
R2 is an optional pull-up for faster recovery and correct biasing of TTL Open Collector
drivers.
ST10F272
Figure 30
RSTOUT
RSTIN
RPD
is not adequate when the RSTIN pin is driven from
+
+
V
CC
R0
C0
C1
External Hardware
IL
(and Interruptible
Power Down
mode)
b) For Power-up
Reset
after the end of the internal reset
a) Hardware
Reset
ST10F272B/ST10F272E

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