STM32F103VET6TR STMicroelectronics, STM32F103VET6TR Datasheet - Page 54

• Manufacturer Part Number: STM32F103VET6TR
• Description: MCU 32BIT ARM 512K FLASH 100-LQF
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103VET6TR

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 80
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: STM32F103x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: CAN, I2C, SPI, USART
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 11
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• On-chip Dac: 12 bit, 2 Channel
• For Use With: 497-10030 - STARTER KIT FOR STM32497-8511 - KIT STARTER FOR STM32 512K FLASH497-6438 - BOARD EVALUTION FOR STM32 512K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Electrical characteristics
5.3.6
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Table 20.
1. f
2. Specific conditions for ADC: f
External clock source characteristics
High-speed external user clock generated from an external source
The characteristics given in
external clock source, and under ambient temperature and supply voltage conditions
summarized in
Table 21.
1. Guaranteed by design, not tested in production.
APB2
DuCy
Symbol
C
f
t
t
V
HSE_ext
V
t
t
in the ADC_CR2 register is set to 1.
w(HSE)
w(HSE)
HCLK
r(HSE)
f(HSE)
in(HSE)
HSEH
HSEL
I
L
(HSE)
= 72 MHz, f
User external clock source
frequency
OSC_IN input pin high level voltage
OSC_IN input pin low level voltage
OSC_IN high or low time
OSC_IN rise or fall time
OSC_IN input capacitance
Duty cycle
OSC_IN Input leakage current
Peripheral current consumption
High-speed external user clock characteristics
Table
Peripheral
APB1
GPIOA
GPIOB
GPIOC
GPIOD
GPIOE
GPIOF
GPIOG
ADC1
ADC2
TIM1
SPI1
TIM8
USART1
ADC3
10.
(1)
= f
HCLK
Parameter
(2)
HCLK
/2, f
Table 21
APB2
Doc ID 14611 Rev 7
= 56 MHz, f
(1)
= f
(1)
(1)
HCLK
result from tests performed using an high-speed
APB1
, default prescaler value for each peripheral.
STM32F103xC, STM32F103xD, STM32F103xE
= f
Typical consumption at 25 °C
V
HCLK
(1)
SS
Conditions
 V
/2, f
(continued)
IN
APB2
 V
= f
DD
0.55
0.72
0.72
0.55
0.72
HCLK
1.9
1.7
1.8
0.4
1.7
0.9
1.7
1
1
0.7V
, f
V
Min
16
45
ADCCLK
1
SS
DD
Typ
= f
8
5
APB2/4
0.3V
Max
V
, ADON bit
25
20
55
±1
DD
DD
Unit
mA
MHz
Unit
µA
pF
ns
%
V