STM32F103VET6TR STMicroelectronics, STM32F103VET6TR Datasheet - Page 109

• Manufacturer Part Number: STM32F103VET6TR
• Description: MCU 32BIT ARM 512K FLASH 100-LQF
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103VET6TR

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 80
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: STM32F103x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: CAN, I2C, SPI, USART
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 11
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• On-chip Dac: 12 bit, 2 Channel
• For Use With: 497-10030 - STARTER KIT FOR STM32497-8511 - KIT STARTER FOR STM32 512K FLASH497-6438 - BOARD EVALUTION FOR STM32 512K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

STM32F103xC, STM32F103xD, STM32F103xE
Figure 61. WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale
1. Drawing is not to scale.
2. Primary datum Z and seating plane are defined by the spherical crowns of the ball.
Table 66.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimension is measured at the maximum ball diameter parallel to primary datum Z.
A
A1
A2
b
e
e1
F
G
D
E
H
L
eee
aaa
Number of balls
(2)
H
Marking area
A1 ball corner
Symbol
eee
Ball
package outline
WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale
package mechanical data
Wafer back side
D
0.535
0.205
0.330
0.290
4.446
4.375
Detail A rotated 90 ˚
Min
b
L
Doc ID 14611 Rev 7
0.585
0.230
0.355
0.320
0.500
3.500
0.447
0.483
4.466
4.395
0.250
0.200
0.05
0.10
millimeters
L
E
Typ
Seating plane (see note 2)
aaa
A1
A2
0.635
0.255
0.380
0.350
4.486
4.415
Side view
Max
A
Detail A
64
Notch
A
B
C
D
E
F
G
H
0.0211
0.0081
0.0130
0.0114
0.1750
0.1722
Min
8
7
Package characteristics
6
Ball side
5
inches
e1
0.0230
0.0091
0.0140
0.0126
0.0197
0.1378
0.0176
0.0190
0.1758
0.1730
0.0098
0.0079
0.0020
0.0039
4
Typ
3
e
(1)
2
G
1
0.0250
0.0100
0.0150
0.0138
0.1766
0.1738
A1 ball corner
Max
109/123
e
F
CR_ME
e1