ST7FLIT19BF0B6 STMicroelectronics, ST7FLIT19BF0B6 Datasheet - Page 148
![IC MCU 8BIT 2K FLASH 20-DIP](/photos/6/89/68911/497-20-dip__300_mil__narrow_pdip_mdip__series_sml.jpg)
ST7FLIT19BF0B6
Manufacturer Part Number
ST7FLIT19BF0B6
Description
IC MCU 8BIT 2K FLASH 20-DIP
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet
1.ST7FLIT15BY1M6.pdf
(159 pages)
Specifications of ST7FLIT19BF0B6
Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
17
Program Memory Size
2KB (2K x 8)
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-DIP (0.300", 7.62mm)
Processor Series
ST7FLIT1x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
17
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
Development Tools By Supplier
ST7FLITE-SK/RAIS, ST7FLIT1B-D/RAIS, ST7MDT10-DVP3, ST7MDT10-EMU3, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 7 Channel
For Use With
497-6232 - BOARD EVAL ST7LITE1B,STP5NK60Z497-5049 - KIT STARTER RAISONANCE ST7FLITE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- Current page: 148 of 159
- Download datasheet (3Mb)
ST7LITE1xB
14.2 SOLDERING INFORMATION
In accordance with the RoHS European directive,
all STMicroelectronics packages have been con-
verted to lead-free technology, named ECO-
PACK
■
■
Table 25. Soldering Compatibility (wave and reflow soldering process)
* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)
is compatible with their Lead-free soldering process.
148/159
SDIP & PDIP
QFN
TQFP and SO
ECOPACK
to the JEDEC STD-020C compliant soldering
profile.
Detailed information on the STMicroelectronics
ECOPACK
www.st.com/stonline/leadfree/,
technical Application notes covering the main
technical
conversion
AN2036).
Package
TM
.
TM
TM
aspects
(AN2033,
transition program is available on
packages are qualified according
Sn (pure Tin)
Sn (pure Tin)
NiPdAu (Nickel-palladium-Gold)
related
Plating material devices
AN2034,
with
to
lead-free
AN2035,
specific
Backward and forward compatibility:
The main difference between Pb and Pb-free sol-
dering process is the temperature range.
– ECOPACK
– TQFP, SDIP and SO Pb-packages are compati-
packages are fully compatible with Lead (Pb)
containing soldering process (see application
note AN2034)
ble with Lead-free soldering process, neverthe-
less it's the customer's duty to verify that the Pb-
packages maximum temperature (mentioned on
the Inner box label) is compatible with their Lead-
free soldering temperature.
Pb solder paste
Yes
Yes
Yes
TM
TQFP, SDIP, SO and QFN20
Pb-free solder paste
Yes *
Yes *
Yes *
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