LPC3141FET180,551 NXP Semiconductors, LPC3141FET180,551 Datasheet - Page 73

• Manufacturer Part Number: LPC3141FET180,551
• Description: IC ARM9 MCU USB OTG 180TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC3000r

Specifications of LPC3141FET180,551

• Package / Case: 180-TFBGA
• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 270MHz
• Connectivity: EBI/EMI, I²C, IrDA, MMC, PCM, SPI, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, PWM, WDT
• Number Of I /o: 20
• Program Memory Type: ROMless
• Ram Size: 192K x 8
• Voltage - Supply (vcc/vdd): 1.1 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC31
• Core: ARM926EJS
• Data Bus Width: 32 bit
• Data Ram Size: 192 KB
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 270 MHz
• Number Of Timers: 5
• Operating Supply Voltage: 1.2 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: OM11037
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935289711551

NXP Semiconductors
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
16. Contact information
For more information, please visit:
For sales office addresses, please send an email to:
LPC3141_3143
Preliminary data sheet
http://www.nxp.com
All information provided in this document is subject to legal disclaimers.
Rev. 0.16 — 27 May 2010
[e-mail]
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I
2
C-bus — logo is a trademark of NXP B.V.
LPC3141/3143
© NXP B.V. 2010. All rights reserved.
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