P89LPC935FDH,529 NXP Semiconductors, P89LPC935FDH,529 Datasheet - Page 69

• Manufacturer Part Number: P89LPC935FDH,529
• Description: IC 80C51 MCU FLASH 8K 28-TSSOP
• Manufacturer: NXP Semiconductors
• Series: LPC900r

Specifications of P89LPC935FDH,529

• Program Memory Type: FLASH
• Program Memory Size: 8KB (8K x 8)
• Package / Case: 28-TSSOP
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 12MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
• Number Of I /o: 26
• Eeprom Size: 512 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x8b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: P89LPC9x
• Core: 80C51
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: I2C/SPI/UART
• Maximum Clock Frequency: 18 MHz
• Number Of Programmable I/os: 26
• Number Of Timers: 2
• Operating Supply Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 8-bit
• Package: 28TSSOP
• Device Core: 80C51
• Family Name: 89LP
• Maximum Speed: 18 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: OM11004 - KIT IAR KICKSTART LPC935622-1014 - BOARD FOR LPC9XX TSSOP622-1008 - BOARD FOR LPC9103 10-HVSON622-1006 - SOCKET ADAPTER BOARDMCB900K - BOARD PROTOTYPE NXP 89LPC9EPM900K - EMULATOR/PROGRAMMER NXP P89LPC9568-4000 - DEMO BOARD SPI/I2C TO DUAL UART568-3510 - DEMO BOARD SPI/I2C TO UART622-1002 - USB IN-CIRCUIT PROG LPC9XX568-1759 - EMULATOR DEBUGGER/PROGRMMR LPC9X568-1758 - BOARD EVAL FOR LPC93X MCU FAMILY
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-1288-5; 935274646529; P89LPC935FDH-S

NXP Semiconductors
14. Package outline
Fig 32. Package outline SOT261-2 (PLCC28)
P89LPC933_934_935_936
Product data sheet
PLCC28: plastic leaded chip carrier; 28 leads
DIMENSIONS (mm dimensions are derived from the original inch dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
inches
UNIT
mm
VERSION
SOT261-2
OUTLINE
0.180
0.165
4.57
4.19
A
min.
0.51
0.02
A 1
β
0.01
0.25
k
A 3
26
28
1
4
max.
3.05
0.12
A 4
y
112E08
IEC
25
5
0.021
0.013
pin 1 index
0.53
0.33
b p
e
0.032
0.026
0.81
0.66
b 1
H
e
D
D
D
11.58
11.43
0.456
0.450
D
(1)
All information provided in this document is subject to legal disclaimers.
JEDEC
MS-018
X
11.58
11.43
0.456
0.450
E
19
(1)
11
REFERENCES
Z D
0
Rev. 8 — 12 January 2011
1.27
0.05
e
8-bit microcontroller with accelerated two-clock 80C51 core
18
12
B
10.92
9.91
0.43
0.39
e D
Z E
v
EDR-7319
e
v
M
JEITA
scale
10.92
9.91
0.43
0.39
M
e E
5
A
E
A
B
H
12.57
12.32
0.495
0.485
E
H D
P89LPC933/934/935/936
12.57
12.32
0.495
0.485
H E
10 mm
0.048
0.042
A
1.22
1.07
k
A
4
0.057
0.040
1.44
1.02
L p
A
e
1
E
w
0.007
0.18
v
detail X
M
PROJECTION
EUROPEAN
0.007 0.004
0.18
b
w
p
L
p
0.1
y
0.085
Z D
max.
b
2.16
(A )
1
(1)
3
© NXP B.V. 2011. All rights reserved.
Z E
max.
0.085
ISSUE DATE
2.16
99-12-27
01-11-15
(1)
SOT261-2
45
β
o
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