LPC2103FHN48H/6,51 NXP Semiconductors, LPC2103FHN48H/6,51 Datasheet - Page 28
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LPC2103FHN48H/6,51
Manufacturer Part Number
LPC2103FHN48H/6,51
Description
IC ARM7 MCU FLASH 32K 48HVQFN
Manufacturer
NXP Semiconductors
Series
LPC2100r
Datasheet
1.LPC2102FHN48551.pdf
(37 pages)
Specifications of LPC2103FHN48H/6,51
Program Memory Type
FLASH
Program Memory Size
32KB (32K x 8)
Package / Case
48-VQFN Exposed Pad, 48-HVQFN, 48-SQFN, 48-DHVQFN
Core Processor
ARM7
Core Size
16/32-Bit
Speed
70MHz
Connectivity
I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
32
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC21
Core
ARM7 TDMI
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
70 MHz
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, DB-LQFP48-LPC2103, MCB2103, MCB2103U, MCB2103UME, KSK-LPC2103-01, KSK-LPC2103-01PL, KSK-LPC2103-02
Development Tools By Supplier
OM10079, OM10081, OM10090
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
935288984518
NXP Semiconductors
LPC2101_02_03_4
Product data sheet
Fig 8.
I
DD(IO)
( A
0.20
0.15
0.10
0.05
Test conditions: Deep power-down mode entered; RTC off; SRAM off; V
V
I/O supply current I
0
DD(1V8)
40
= 1.8 V; V
Rev. 04 — 2 June 2009
i(BAT)
15
DD(IO)
= V
DDA
measured at different temperatures
= 3.3 V.
10
Single-chip 16-bit/32-bit microcontrollers
35
LPC2101/02/03
60
Temperature ( C)
DD(3V3)
002aae682
© NXP B.V. 2009. All rights reserved.
= 3.3 V;
85
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