DSPIC30F6010A-30I/PT Microchip Technology, DSPIC30F6010A-30I/PT Datasheet - Page 11
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DSPIC30F6010A-30I/PT
Manufacturer Part Number
DSPIC30F6010A-30I/PT
Description
IC DSPIC MCU/DSP 144K 80TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F6011A-30IPT.pdf
(6 pages)
2.DSPIC30F6015-30IPT.pdf
(232 pages)
3.DSPIC30F6015-30IPT.pdf
(14 pages)
4.DSPIC30F6015-30IPT.pdf
(12 pages)
5.DSPIC30F6015-30IPT.pdf
(18 pages)
6.DSPIC30F6010A-30IPF.pdf
(22 pages)
7.DSPIC33FJ128MC506-IPT.pdf
(24 pages)
Specifications of DSPIC30F6010A-30I/PT
Program Memory Type
FLASH
Program Memory Size
144KB (48K x 24)
Package / Case
80-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
68
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
68
Data Ram Size
8 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, ICE4000, DM240002, DM300020, DM330011, DM300019
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300019 - BOARD DEMO DSPICDEM 80L STARTERXLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC30F007 - MODULE SKT FOR DSPIC30F 80TQFPDM300020 - BOARD DEV DSPICDEM MC1 MOTORCTRLDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F6010A30IP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6010A-30I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6010A-30I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
22. Module: High I
23. Module: Regulating Voltage for
TABLE 3:
© 2008 Microchip Technology Inc.
Note 1:
This release of silicon draws a current (I
approximately 370 mA during any Row Erase
operation performed on program Flash memory.
Work arounds
Work around 1:
Supply the V
capable of sourcing a minimum of 300 mA of
current.
Work around 2:
When using a voltage regulator capable of driving
150 mA current, and if Brown-out Reset (BOR) is
enabled for a V
then connect a 1000 μF Electrolytic capacitor
across the V
If the Row Erase operation is performed as part of
a Run-Time Self-Programming (RTSP) operation,
the user should ensure that the device is operating
at less than 10 MIPS prior to the erase operation.
To ensure the device is operating at less than
10 MIPS, the application may post-scale the
system clock or switch to the Internal FRC
oscillator.
For this release of silicon, applications operating
off 5 volts V
remains between 4.75V and 5.5V. For 5V
applications, Table 3 summarizes the maximum
MIPS that can be achieved across various
temperatures.
Work around
For 5 volt applications, use a voltage regulator that
ensures V
to achieve 30 MIPS operation.
V
4.75 to 5.5
4.75 to 5.5
(in volts)
DD
Range
Applications that use the CAN peripherals and Data EEPROM should also refer to Errata 1. and 21.
DD
Program Flash Memory
5V/30 MIPS Applications
OPERATING MIPS VS. VOLTAGE
DD
DD
is in the range 4.75V to 5.5V, in order
DD
at 30 MIPS should ensure the V
pin and ground.
DD
DD
pin using a voltage regulator
greater than or equal to 4.2V,
During Row Erase of
Temp Range
-40 to +125
-40 to +85
(in °C)
DD
dsPIC30FXXX-30I
) of
DD
(1)
30
—
dsPIC30FXXX-20I
Max MIPS
dsPIC30F6010
20
—
dsPIC30FXXX-20E
DS80195H-page 11
20
—