AT89C51CC01UA-RLTUM Atmel, AT89C51CC01UA-RLTUM Datasheet - Page 159

• Manufacturer Part Number: AT89C51CC01UA-RLTUM
• Description: IC 8051 MCU FLASH 32K 44-VQFP
• Manufacturer: Atmel
• Series: AT89C CANr

Specifications of AT89C51CC01UA-RLTUM

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 34
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 2K x 8
• Ram Size: 1.25K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TQFP, 44-VQFP
• Processor Series: AT89x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 1280 B
• Interface Type: UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 34
• Number Of Timers: 2
• Operating Supply Voltage: 3 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: CANADAPT28
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Package: 44VQFP
• Device Core: 8051
• Family Name: AT89
• Maximum Speed: 40 MHz
• Cpu Family: AT89
• Device Core Size: 8b
• Frequency (max): 40MHz
• Total Internal Ram Size: 1.25KB
• # I/os (max): 34
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 3V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: VQFP
• For Use With: AT89OCD-01 - USB EMULATOR FOR AT8XC51 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: AT89C51CC01UARLTUM

4129N–CAN–03/08
STANDARD NOTES FOR PQFP/ VQFP / TQFP / DQFP
1/ CONTROLLING DIMENSIONS : INCHES
2/ ALL DIMENSIONING AND TOLERANCING CONFORM TO ANSI Y 14.5M -
1982.
3/ "D1 AND E1" DIMENSIONS DO NOT INCLUDE MOLD PROTUSIONS.
THE TOP PACKAGE BODY SIZE MAY BE SMALLER THAN THE BOTTOM
4/ DATUM PLANE "H" LOCATED AT MOLD PARTING LINE AND
COINCIDENT WITH LEAD, WHERE LEAD EXITS PLASTIC BODY AT
5/ DATUM "A" AND "D" TO BE DETERMINED AT DATUM PLANE H.
6/ DIMENSION " f " DOES NOT INCLUDE DAMBAR PROTUSION ALLOWABLE
" f " DIMENSION AT MAXIMUM MATERIAL CONDITION .
DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT.
MOLD PROTUSIONS SHALL NOT EXCEED 0.25 mm (0.010 INCH).
PACKAGE BODY SIZE BY AS MUCH AS 0.15 mm.
BOTTOM OF PARTING LINE.
DAMBAR PROTUSION SHALL BE 0.08mm/.003" TOTAL IN EXCESS OF THE
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