PIC18LF258-I/SP Microchip Technology, PIC18LF258-I/SP Datasheet - Page 382
![IC MCU FLASH 16KX16 LV CAN 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC18LF258-I/SP
Manufacturer Part Number
PIC18LF258-I/SP
Description
IC MCU FLASH 16KX16 LV CAN 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16C770-ISO.pdf
(8 pages)
3.PIC18LF242-ISO.pdf
(36 pages)
4.PIC18F248-ISO.pdf
(402 pages)
5.PIC18F248-ISO.pdf
(8 pages)
Specifications of PIC18LF258-I/SP
Core Size
8-Bit
Program Memory Size
32KB (16K x 16)
Oscillator Type
External
Core Processor
PIC
Speed
40MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
22
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 5x10b
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Controller Family/series
PIC18
No. Of I/o's
22
Eeprom Memory Size
256Byte
Ram Memory Size
1536Byte
Cpu Speed
40MHz
No.
RoHS Compliant
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
22
Number Of Timers
4 bit
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163011, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18LF258-I/SP
Manufacturer:
Microchip Technology
Quantity:
135
- PIC16F616T-ISL PDF datasheet
- PIC16C770-ISO PDF datasheet #2
- PIC18LF242-ISO PDF datasheet #3
- PIC18F248-ISO PDF datasheet #4
- PIC18F248-ISO PDF datasheet #5
- Current page: 382 of 402
- Download datasheet (7Mb)
28-Lead Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC)
DS41159E-page 380
PIC18FXX8
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45
E1
E
Dimension Limits
h
§
Units
A2
A1
E1
A
E
D
B
n
p
h
L
c
2
1
D
L
MIN
.093
.088
.004
.394
.288
.695
.010
.016
.009
.014
0
0
0
A1
INCHES *
A
NOM
28
.050
.099
.008
.407
.295
.704
.020
.033
.017
.091
.011
12
12
4
MAX
.012
.420
.299
.104
.094
.712
.029
.050
.013
.020
15
15
8
MIN
17.65
10.01
2.36
2.24
0.10
7.32
0.25
0.23
0.36
0.41
0
0
0
MILLIMETERS
© 2006 Microchip Technology Inc.
NOM
28
10.34
17.87
1.27
2.50
0.20
7.49
0.50
0.84
0.28
0.42
2.31
12
12
4
MAX
A2
10.67
18.08
2.64
2.39
0.30
7.59
0.74
1.27
0.33
0.51
15
15
8
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